Multi-layered Dielectric Structure for Embedded Packages
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Solution Overview
Problem
The miniaturization of interconnections and connection structures in embedded packages is hindered by the increased surface roughness of dielectric layers caused by fillers, which affects the mechanical and thermal characteristics, making it difficult to scale down further.
Innovation Solution
The use of a multi-layered dielectric structure with first and second fillers of different average sizes, where the second fillers are less than 1 micrometer and the first fillers are greater than or equal to 1 micrometer, dispersed in epoxy or polymer resin materials, with the second fillers having a lower weight content and a reinforcing agent like glass fiber, to create a stack structure that reduces surface roughness and enhances mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If fillers are introduced into the dielectric layer to improve mechanical and thermal characteristics, then the coefficient of thermal expansion is lowered and rigidity is enhanced, but the surface roughness increases
Solution Approach 1:
The dielectric layer is segmented into multiple layers (first dielectric layer and second dielectric layer), each containing fillers of different size ranges. The first dielectric layer contains larger fillers (1-7 μm) for mechanical strength, while the second dielectric layer contains smaller fillers (0.1-1 μm) for smooth surface, thereby resolving the contradiction between rigidity and surface roughness
Solution Approach 2:
Different regions of the dielectric structure are assigned different filler characteristics: the first dielectric layer (surrounding sidewalls) uses larger fillers for mechanical support, while the second dielectric layer (covering top surface) uses smaller fillers for surface quality. This local differentiation allows each region to optimize its function without compromising the other
2Manufacturing precision
If the surface roughness of the dielectric layer is reduced to enable smaller interconnections, then the manufacturing precision improves, but the mechanical stability may be compromised
Solution Approach 1:
The dielectric structure is divided into two layers with different filler sizes: larger fillers in the first layer provide mechanical stability, while smaller fillers in the second layer enable smooth surface for fine interconnections. This segmentation allows both requirements to be satisfied simultaneously in different regions
Solution Approach 2:
The patent uses composite dielectric materials combining epoxy resin or polymer resin with ceramic fillers of different size ranges in each layer. This composite approach allows optimization of both mechanical properties (through larger fillers) and surface properties (through smaller fillers) within the same overall structure
Data Source
AI summary
The embedded package includes a semiconductor chip having contact portions disposed on a top surface thereof, a first dielectric layer substantially surrounding sidewalls of the semiconductor chip and including first fillers dispersed therein, a second dielectric layer substantially covering the top surface of the semiconductor chip and including second fillers dispersed therein, and first external interconnection portions disposed on the second dielectric layer and electrically connected to the contact portions, wherein an average size of the first fillers is different from that of the second fillers.