Multi-layered Film Light Reflectance in LED Mount Boards
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Solution Overview
Problem
Existing light-emitting apparatuses face challenges in enhancing luminous efficiency due to inadequate light reflectivity and thermal resistance in the emission wavelength region of LEDs.
Innovation Solution
A light-emitting apparatus featuring a mount board with a multi-layered film stack including nickel, silver, aluminum oxide, silicon dioxide, and titanium oxide layers, which is applied to the mount board exposed in an opening of a circuit board, enhancing light reflectance and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal support (aluminum) is used for the mount board to ensure thermal resistance and heat dissipation, then heat dissipation is improved, but light reflectivity in the LED emission wavelength region is insufficient
Solution Approach 1:
The patent applies composite materials by combining multiple layers with different properties: a metal support layer for thermal management, a reflective layer (silver or aluminum) for light reflection, and protective layers (transparent resin or oxide layers) for durability. This composite structure simultaneously achieves heat dissipation, high light reflectivity (>95%), and environmental protection, resolving the contradiction between thermal performance and optical performance.
2Illumination intensity
If a multi-layered film containing silver is stacked on the mount board to improve light reflectance, then light reflectivity is improved, but the device structure becomes more complex
Solution Approach 1:
The patent segments the mount board surface into distinct functional layers: a reflective layer (silver or aluminum) for light reflection, intermediate protective layers (oxide layers such as Al2O3 or SiO2) for corrosion protection and adhesion, and an outer transparent protective layer. This segmentation allows each layer to perform its specific function optimally while achieving >95% overall reflectivity.
Solution Approach 2:
The multi-layered film structure serves multiple functions simultaneously: the reflective layer provides high light reflectivity, intermediate oxide layers provide corrosion protection and adhesion promotion, and the transparent protective layer provides environmental protection while maintaining optical transparency. This multi-functionality justifies the increased structural complexity by delivering comprehensive performance benefits.
3Illumination intensity
If silver layer is used as light-reflecting material to achieve high reflectance, then light reflectivity is improved, but cost and manufacturing complexity increase
Solution Approach 1:
The patent provides design flexibility by allowing parameter changes in the reflective layer material selection. Engineers can choose silver for maximum reflectivity (>95%) or aluminum for a balance of reflectivity and cost. The patent also specifies thickness ranges (silver: 5-100 nm, aluminum: 10-200 nm) to optimize performance while controlling manufacturing complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves light reflectance to over 95% in the emission wavelength region of LEDs, enhancing luminous efficiency and maintaining thermal stability, thereby improving the overall performance of the light-emitting apparatus.
Implementation Method 1
a multi-layered film containing silver as a light-reflecting material... the mount board has a light reflectance of more than or equal to 95% in a whole emission wavelength region of the LED element
Implementation Method 2
a layer containing silver as a light-reflecting material is fabricated by vapor deposition
Data Source
AI summary
A light-emitting apparatus is provided which can improve the reflectance of light in the emission wavelength region of the LED. The light-emitting apparatus includes a mount board constituted by a metal support, a circuit board provided with an opening and fixed onto the mount board, a multi-layered film containing silver as a light-reflecting material, the multi-layered film being stacked on the mount board exposed in the opening, exclusive of a portion of the mount board onto which the circuit board is fixed, and an LED element mounted on the multi-layered film.