Multi-Layered Head Interconnect for Data Storage Reliability

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Solution Overview

Problem

Existing interconnect structures in data storage devices are inadequate for reliable and durable electrical connections between transducer elements and circuitry, particularly in environments prone to damage and corrosion.

Innovation Solution

A multiple layered interconnect structure is introduced, featuring a first and second interconnecting layer with conductive pads and strips, an insulating layer, and a protective cover, formed on the back surface of the slider body to provide robust and protected electrical connections between transducer elements and circuitry.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a single-layer interconnect structure is used, then the device complexity is low, but the reliability and durability of electrical connections are insufficient

Engineering Contradiction:

Improvereliability of electrical connectionsVSAvoidcomplexity of interconnect structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent transitions from a single-layer interconnect structure to a multi-layer interconnect structure, adding vertical dimensionality. The first and second interconnecting layers are stacked with an insulating layer between them, creating a three-dimensional arrangement that improves connection reliability while managing complexity through systematic layering.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The interconnect structure employs composite construction by combining multiple materials with different properties: conductive materials for the first and second interconnecting layers, insulating material for the intermediate layer, and protective coating materials. This composite approach enhances overall reliability by leveraging the strengths of each material while protecting against corrosion and damage.

Inventive Principle:

Principle #40Composite materials

2Object-affected harmful factors

If transducer elements are exposed without protection, then the ease of manufacture is high, but the susceptibility to damage and corrosion increases

Engineering Contradiction:

Improveprotection against damage and corrosionVSAvoidease of manufacturing interconnect structure

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The protective coating is applied in advance to cover the conductive traces and bond pads before final assembly. This preliminary protective action prevents damage and corrosion during manufacturing and operation, while the coating process is integrated into the manufacturing workflow to maintain ease of production.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent utilizes thin film protective coatings deposited over the interconnect structure. These thin films provide effective protection against damage and corrosion while adding minimal thickness and complexity to the overall structure, maintaining ease of manufacture through established thin film deposition techniques.

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS8902547B1Multiple layered head interconnect structure

Publication Date: 2014.12.02 SEAGATE TECH LLC

AI summary

A multiple layered interconnect structure to provide an electrical interface between one or more electrical elements on a head to read/write circuitry is disclosed. The interconnect structure includes first and second interconnecting layers. The first interconnecting layer is formed on a slider body of the head and includes a first or lower bond pad connectable to one or more electrical elements on the slider body through the first interconnecting layer. The second interconnecting layer includes a second or upper bond pad connectable to the one or more transducer elements through the second interconnecting layer. The second interconnecting layer is on top of the first interconnecting layer and the structure includes an insulating layer between the first and second interconnecting layers. In illustrated embodiments, the first and second interconnecting layers are formed on a back side or surface of the slider body to form top side upper and lower bond pads that interface with bond pads on a flex circuit to provide the interface to R/W circuitry.