Multi-Lead Adapter for Small-Package PCB Footprint Compatibility
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Solution Overview
Problem
The semiconductor industry's trend towards smaller package sizes poses compatibility issues with existing systems, requiring costly and time-consuming redesigns in industries like automotive, where maintaining standard package sizes is preferable.
Innovation Solution
A multi-lead adapter with leads arranged to match both small and larger package footprints, allowing small packages to be retroactively compatible with systems designed for larger packages, including printed circuit boards and other devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If package size is reduced to meet semiconductor industry trends, then device miniaturization is achieved, but compatibility with existing systems is lost
Solution Approach 1:
The patent introduces a multi-lead adapter as an intermediary component between the small semiconductor package and the existing system interface. The adapter has a first footprint that matches the small package and a second footprint that matches the standard SOIC interface, thereby mediating the compatibility issue without requiring changes to either the package or the existing system
Solution Approach 2:
The solution segments the connection interface into two separate parts: the package footprint and the system interface footprint. By introducing the adapter as a separate component, the system is divided such that the package connects to the adapter, and the adapter connects to the system, allowing each part to have optimized dimensions independently
2Volume of moving object
If package size is reduced, then device miniaturization is achieved, but system redesign costs and time increase
Solution Approach 1:
The multi-lead adapter is designed and manufactured in advance with standardized footprints that match existing system interfaces. This preliminary preparation of the adapter component allows for retroactive compatibility without requiring time-consuming redesigns of existing systems when new small packages are introduced
3Volume of moving object
If package size is reduced, then device miniaturization is achieved, but manufacturing and integration complexity increase
Solution Approach 1:
The multi-lead adapter serves multiple functions: it provides mechanical support for the small package, establishes electrical connections between the package leads and system interface, and maintains compatibility with standard mounting and soldering processes. This multi-functionality reduces overall system complexity despite the added component
Data Source
AI summary
In some examples, a device comprises an electronic component having multiple electrical connectors, the multiple electrical connectors configured to couple to a printed circuit board (PCB) and having a first footprint. The device also comprises a multi-lead adapter comprising multiple rows of leads arranged in parallel, the leads in the rows configured to couple to the electrical connectors of the electronic component and having a second footprint that has a different size than the first footprint.