Multi-Leaf Flexible Circuit Layout for Smaller Ultrasound Catheters
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Solution Overview
Problem
The complexity and cost of manufacturing small form-factor electronic components for intravascular catheters are increased due to their compact size, making it challenging to integrate and test electronic components like ultrasound transducers and electronics packages effectively.
Innovation Solution
A flexible electronic circuit design featuring a plurality of leaves with bonded proximal and distal sections and loose intermediate sections, equipped with conductive and test connector pads, allows for the integration of ultrasound transducers and electronics packages, simplifying manufacturing and testing by reducing the need for complex vias and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If small form-factor electronic components are used in intravascular catheters, then the catheter size is reduced, but the manufacturing complexity and cost increase
Solution Approach 1:
The flexible circuit is divided into multiple leaves that are bonded together in specific sections. The proximal section has leaves bonded in a stacked configuration, the intermediate section has leaves separated to form flying leads, and the distal section has leaves bonded to form a substrate. This segmentation allows each section to be optimized for its specific function while simplifying overall manufacturing.
Solution Approach 2:
The patent transitions from a traditional planar circuit board to a three-dimensional stacked leaf configuration. Multiple circuit layers are stacked vertically and bonded together, creating a multi-layer flexible circuit structure that reduces the catheter tip footprint while maintaining complex electrical connectivity.
2Volume of moving object
If small form-factor electronic components are used in intravascular catheters, then the catheter size is reduced, but the manufacturing cost increases
Solution Approach 1:
The flexible circuit is divided into multiple leaves that are bonded together in specific sections. The proximal section has leaves bonded in a stacked configuration, the intermediate section has leaves separated to form flying leads, and the distal section has leaves bonded to form a substrate. This segmentation allows each section to be optimized for its specific function while simplifying overall manufacturing.
Solution Approach 2:
The patent transitions from a traditional planar circuit board to a three-dimensional stacked leaf configuration. Multiple circuit layers are stacked vertically and bonded together, creating a multi-layer flexible circuit structure that reduces the catheter tip footprint while maintaining complex electrical connectivity.
3Ease of manufacture
If traditional circuit board designs are used, then manufacturing is simpler, but integration and testing of electronic components becomes more complex
Solution Approach 1:
The flexible circuit is divided into multiple leaves that are bonded together in specific sections. The proximal section has leaves bonded in a stacked configuration, the intermediate section has leaves separated to form flying leads, and the distal section has leaves bonded to form a substrate. This segmentation allows each section to be optimized for its specific function while simplifying overall manufacturing.
Solution Approach 2:
The loose intermediate section acts as an intermediary between the proximal and distal sections, allowing the circuit to be tested and configured before final assembly. The flying leads in this section provide access points for testing electronic components while maintaining connection to the bonded sections.
4Strength
If leaves are bonded together throughout the entire circuit, then structural integrity is improved, but flexibility and ease of testing is reduced
Solution Approach 1:
Different sections of the flexible circuit have different bonding characteristics. The proximal section has leaves bonded in a stacked configuration for structural integrity, the intermediate section has leaves separated for flexibility and testing access, and the distal section has leaves bonded to form a rigid substrate for component mounting. This local differentiation optimizes each section for its specific requirements.
Data Source
AI summary
A flexible electronic circuit includes a plurality of leaves having a proximal section, a distal section, and an intermediate section. The plurality of leaves are bonded to each other within the distal section and loose within the intermediate section. The intermediate section also includes conductive connector pads for a wiring harness. A plurality of test connector pads are disposed on the plurality of leaves within the proximal section. The leaves within the proximal section may also be bonded to each other, for example in a ribbon or stepped configuration, in order to facilitate connection to testing apparatus. Once the circuit is tested, the proximal section can be severed from the intermediate section prior to installation of the circuit into a medical device, such as an intracardiac echocardiography catheter.