Multi-lenslet PIC Imagers with Stacked 3D Configurations
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Solution Overview
Problem
Current segmented planar imaging detectors for electro-optical reconnaissance have limitations in size, weight, and cost, and require more efficient configurations to achieve higher imaging resolution and spatial frequency sampling.
Innovation Solution
The use of multi-lenslet photonic integrated circuit (PIC) imagers with top and bottom substrate spacers, coupled with optical prisms and waveguides, allows for extended baseline separation and increased manufacturable size, enabling higher imaging resolution and spatial frequency sampling through various configurations such as dual-lenslet arrays, nested fan, and stacked configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multi-lenslet PIC imagers with extended baseline separation are used, then imaging resolution and spatial frequency sampling are improved, but device size and weight increase
Solution Approach 1:
The patent transitions from planar 2D baseline arrangements to three-dimensional stacked configurations of PIC imagers. By stacking multiple PIC imager modules vertically with precise spacing, the system achieves extended baseline separation in the vertical dimension while maintaining a compact horizontal footprint, thereby improving imaging resolution without proportionally increasing overall system weight.
Solution Approach 2:
The patent employs nested configurations where multiple lenslet arrays and PIC imager modules are arranged in concentric or hierarchical patterns. Smaller baseline configurations are nested within larger ones, allowing the system to achieve multiple spatial frequency sampling levels simultaneously while optimizing the weight-to-performance ratio through shared structural support.
2Measurement precision
If multi-lenslet PIC imagers with extended baseline separation are used, then imaging resolution and spatial frequency sampling are improved, but device size increases
Solution Approach 1:
The patent utilizes vertical stacking of PIC imager modules to achieve extended baseline separation primarily in the vertical dimension (z-axis) rather than expanding the horizontal area (x-y plane). This dimensional transition allows the system to achieve high imaging resolution with a compact footprint suitable for space-constrained applications.
Solution Approach 2:
The patent employs adjustable and reconfigurable optical paths within the stacked PIC imager configuration. By making certain optical components movable or reconfigurable, the system can dynamically adjust baseline separation and spatial frequency sampling without requiring fixed large-area mechanical structures, thereby reducing the overall device area while maintaining high imaging resolution.
3Measurement precision
If stacked configurations of multi-lenslet PIC imagers are used, then spatial frequency sampling is improved, but device complexity increases
Solution Approach 1:
The patent divides the overall interferometric imaging system into multiple discrete PIC imager modules, each handling specific spatial frequency sampling tasks. By segmenting the system into standardized, modular PIC imager units that can be stacked and configured independently, the complexity of each individual module is reduced and managed, while the collective system achieves high spatial frequency sampling capability.
Solution Approach 2:
The patent designs the PIC imager modules with universal, multi-functional capabilities that allow the same basic module architecture to serve multiple functions in the stacked configuration. Each PIC imager module can function independently or in combination with others, performing both imaging and spatial frequency sampling tasks, thereby reducing overall system complexity through component reuse and standardized interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances imaging resolution and spatial frequency sampling capabilities, allowing for a larger distribution of baselines and richer sampling of spatial frequencies without increasing the size and weight of the imaging system, while maintaining compactness and efficiency.
Implementation Method 1
A first optical prism couples a first lenslet array to a first-side edge of the PIC. A second optical prism couples a second lenslet array to a second-side edge of the PIC.
Implementation Method 2
A number of waveguides are embedded in the PIC and are used to couple respective lenslets of the lenslet arrays
Data Source
AI summary
A dual-lenslet array photonic integrated circuit (PIC) imager includes a PIC and top and bottom substrate spacers. A first optical prism couples a first lenslet array to a first-side edge of the PIC. A second optical prism couples a second lenslet array to a second-side edge of the PIC. Lenslets of the first lenslet array and respective lenslets of the second lenslet array are coupled to respective waveguides embedded in the in the PIC.