Multi-Level Boost Converter Reducing Inductor Ripple

The patent divides the voltage step-up process into multiple stages using a multi-level boost converter topology. Instead of achieving high voltage in a single stage, the converter uses multiple capacitors (C1, C2, C3) and switches (S1-S7) to create intermediate voltage levels, progressively stepping up the voltage from Vin to Vout. This segmentation reduces the voltage stress on individual switches and decreases switching losses, thereby improving overall conversion efficiency while achieving the required high output voltage.

The patent segments the inductor current path across multiple parallel branches, each with its own inductor (L1, L2, L3). By distributing the total current through multiple smaller inductors operating in parallel, the current ripple in each individual inductor is reduced while keeping the physical size of each inductor small. This approach avoids the need for a single large inductor with high inductance, thus reducing overall inductor volume while maintaining low current ripple.

The patent uses a multi-level topology with multiple capacitors (C1, C2, C3) that create intermediate voltage levels during the switching cycles. This segmentation allows the converter to achieve the required current ripple control at lower switching frequencies compared to conventional single-stage boost converters. The distributed capacitor network reduces the voltage swing across the inductor, thereby reducing inductor core losses and switching losses while maintaining effective current ripple control.

The patent divides the total inductance requirement across multiple parallel inductor branches (L1, L2, L3). Each inductor can be designed with fewer turns and thicker wire, resulting in lower individual DCR. When connected in parallel, these smaller inductors collectively provide the required total inductance while maintaining lower overall resistance compared to a single large inductor. This segmentation approach reduces I²R losses in the inductor.

The patent employs a multi-level boost converter topology that segments the voltage conversion function across multiple capacitors and switches arranged in a structured pattern. While this does increase component count compared to simple converters, the segmented architecture enables high voltage step-up with reduced switching losses and allows for modular PCB layout. The systematic arrangement of components (three capacitors, seven switches, and three inductors) facilitates efficient space utilization and reduces overall device complexity in terms of control and thermal management.