Multi-Level Conductor Roughness Model for High-Frequency Accuracy

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Solution Overview

Problem

Conventional models for modeling conductor surface roughness, such as the Hammerstad, hemispherical, and Huray models, lose accuracy at high frequencies and require empirical determination of parameter values, making them inefficient and unreliable for broad frequency ranges in high-speed circuit designs.

Innovation Solution

A multi-level modeling approach that identifies protrusions at successive levels, determines correction factors for each level, and combines them to calculate a final correction factor for surface resistance, enabling accurate modeling of surface roughness across a broad frequency range.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional analytical models (Hammerstad, hemispherical, Huray) are used to model conductor surface roughness, then the modeling can be incorporated into circuit simulations, but the accuracy is lost at high frequencies

Engineering Contradiction:
Improvecomputational efficiency for circuit simulationsVSAvoidmodeling accuracy at high frequencies
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The surface roughness is segmented into multiple hierarchical levels, where each level represents protrusions of a specific size range. The multi-level model divides the continuous roughness profile into discrete levels, with each level contributing to the total correction factor. This segmentation allows the model to capture roughness effects across different frequency ranges while maintaining computational efficiency through analytical calculations at each level.

Inventive Principle:
Principle #1Segmentation

2Measurement precision

If the Huray model is used to improve accuracy up to 50 GHz, then relatively good accuracy is achieved, but the model parameter values are not easily determined and require empirical determination

Engineering Contradiction:
Improvemodeling accuracy up to 50 GHzVSAvoidcomplexity of determining model parameters
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The model parameters are changed from empirical values requiring iterative determination to parameters directly derived from standard roughness measurements (Rq, Rms). The multi-level model transforms the complex parameter determination process into a systematic calculation based on measurable surface characteristics, eliminating the need for empirical optimization while maintaining accuracy across frequency ranges.

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If numerical electromagnetic simulations are used on specific roughness structures, then the conductor surface roughness effect is calculated, but the computational cost is too expensive for circuit simulations

Engineering Contradiction:
Improveaccuracy of roughness effect calculationVSAvoidcomputational cost for simulations
Core Design Contradiction:
Measurement precisionVSUse of energy by moving object

Solution Approach 1:

The numerical electromagnetic simulation approach is replaced with an analytical model that uses mathematical formulas to calculate the correction factor. Instead of performing computationally intensive full-wave electromagnetic simulations, the patent uses closed-form expressions that incorporate roughness parameters and frequency dependencies, achieving similar accuracy with dramatically reduced computational cost suitable for circuit simulation tools.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Device complexity

If single-level models are used for surface roughness, then the modeling is simple, but the accuracy is insufficient for broad frequency ranges

Engineering Contradiction:
Improvesimplicity of modeling approachVSAvoidaccuracy over broad frequency range
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The model transitions from a single-level approximation to a multi-level hierarchical structure, adding the dimension of scale to the roughness representation. Each level captures roughness features at a specific size scale, and the combination of levels provides comprehensive coverage across frequency ranges. This dimensional expansion from single-level to multi-level modeling enables broad frequency accuracy while maintaining analytical simplicity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS8527246B1Method for modeling conductor surface roughness
Publication Date: 2013.09.03 KEYSIGHT TECHNOLOGIES INC
  • US8527246B1 patent drawing
  • US8527246B1 patent drawing
  • US8527246B1 patent drawing

AI summary

A method provides modeling of surface roughness effect of an electrical conductor. The method includes identifying first protrusions of a first level using an original flat surface of the conductor as a first base surface and determining a first correction factor of the first level using parameters of the first protrusions. The method further includes identifying second protrusions of a second level using the first protrusions and the first base surface as a second base surface, and determining a second correction factor of the second level using parameters of the second protrusions and regarding the second base surface as being a smooth surface, the smooth surface being a surface of the conductor without surface roughness effect. A final correction factor of the conductor is determined by combining the first correction factor and the second correction factor.