Multi-Level Cooling Plate for Uniform CPU Heat Dissipation
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Solution Overview
Problem
Existing cooling systems for heat generating elements in electronic devices, such as CPUs, face challenges in achieving uniform cooling due to local imbalances in cooling ability, which can lead to inefficient heat transfer and increased thermal resistance.
Innovation Solution
A cooling plate design featuring alternating feed and return flow paths for coolant, with multiple levels of coolant flow paths closer to the heat generating element, allowing for parallel communication between adjacent paths, thereby ensuring even cooling and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cooling systems are used with simple flow paths, then the device complexity is low, but local imbalances in cooling ability occur leading to inefficient heat transfer
Solution Approach 1:
The cooling plate is divided into multiple levels with feed flow paths and return flow paths alternatingly arranged. This segmentation creates multiple coolant flow paths at different levels, allowing for more uniform heat distribution and improved cooling efficiency without excessive complexity.
Solution Approach 2:
The invention introduces a multi-level structure with coolant flow paths formed in multiple levels within the plate. This dimensional change from single-level to multi-level flow paths enables better heat transfer by distributing coolant across different vertical levels, improving cooling ability while maintaining manageable complexity.
2Temperature
If coolant flow paths are placed closer to the heat generating element, then heat transfer efficiency improves, but thermal resistance increases due to uneven cooling distribution
Solution Approach 1:
The cooling plate implements local quality by having coolant flow paths at different levels with alternating feed and return paths. This allows different regions of the plate to have optimized cooling characteristics, with coolant distributed more effectively across the plate face, improving overall heat transfer efficiency while reducing thermal resistance through localized cooling optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively enhances the cooling ability of CPUs by ensuring a consistent flow of coolant across the plate, reducing thermal resistance and maintaining even cooling over the entire contact area, as demonstrated by comparative thermal resistance reduction graphs.
Implementation Method 1
a cooling plate includes: a plate that is attached to a heat generating element; feed flow paths and return flow paths for coolant that are alternatingly arranged along a plate face of the plate; and a plurality of coolant flow paths that are formed in a plurality of levels within the plate
Data Source
AI summary
A cooling plate that includes: a plate that is attached to a heat generating element; feed flow paths and return flow paths for coolant that are alternatingly arranged along a plate face of the plate; and a plurality of coolant flow paths that are formed in a plurality of levels within the plate closer to the heat generating element than the feed flow paths and the return flow paths, the plurality of coolant flow paths placing adjacent paths of the feed flow paths and the return flow paths in parallel communication through each of the levels.