Multi-level distributed clamps for stacked die power delivery
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Long current paths in semiconductor devices lead to increased impedance and voltage droop when bursts of power are required, which existing technologies have not effectively addressed.
Innovation Solution
The implementation of multi-level distributed clamps placed adjacent to core loads on stacked dies to focus power delivery to high demand areas, reducing current loop lengths and parasitics, and incorporating integrated voltage regulators and capacitors to stabilize voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power delivery components are placed on a system board near the semiconductor device, then power delivery capability is improved, but current path length increases leading to increased impedance and voltage droop
Solution Approach 1:
The patent transitions from a planar power delivery architecture to a three-dimensional stacked die architecture. By placing power delivery components on a separate die stacked vertically above the core die, the invention achieves short current paths through vertical interconnects (TSVs) while maintaining high power delivery capability. This dimensional change resolves the contradiction by eliminating long horizontal current paths.
Solution Approach 2:
The patent segments the semiconductor device into multiple functional dies: a core die containing logic circuits and a separate power delivery die containing voltage regulators and clamps. This segmentation allows each die to be optimized for its specific function while being interconnected through vertical vias, thereby reducing current path length while maintaining power delivery capability.
2Loss of energy
If voltage regulation components are integrated onto an integrated circuit die, then power delivery efficiency is improved, but device complexity increases
Solution Approach 1:
The patent segments power delivery functionality into discrete voltage regulator modules and clamp modules that are implemented as separate functional blocks on the power delivery die. This modular segmentation improves power delivery efficiency by placing regulation components close to load regions while managing complexity through standardized module designs that can be replicated and configured based on specific power delivery requirements.
3Ease of manufacture
If clamps are located along a periphery of the die, then device layout is simplified, but current paths become relatively long particularly for demand areas near the center
Solution Approach 1:
The patent moves clamp modules from a two-dimensional periphery layout to a three-dimensional distributed arrangement on the power delivery die. Multiple clamp modules are positioned at different locations on the power delivery die and connected to various regions of the core die through vertical vias, enabling short current paths to both peripheral and central regions while maintaining manufacturing simplicity through standardized module replication.
Data Source
AI summary
An apparatus is provided which comprises: a first set of one or more contacts on a first die surface, the first set of one or more contacts to couple with contacts of an integrated circuit die, one or more multi-level voltage clamps coupled with the first set of one or more contacts, the one or more multi-level voltage clamps switchable between two or more voltages, one or more integrated voltage regulators coupled with the one or more multi-level voltage clamps, the one or more integrated voltage regulators to provide an output voltage, one or more through silicon vias (TSVs) coupled with the one or more integrated voltage regulators, and a second set of one or more contacts on a second die surface, opposite the first die surface, the second set of one or more contacts coupled with the one or more TSVs, and the second set of one or more contacts to couple with contacts of a package substrate. Other embodiments are also disclosed and claimed.