Multi-Level Interconnect Apparatus Bandwidth Density
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Solution Overview
Problem
Current multi-chip module (MCM) assemblies face a trade-off between increased size and reduced contact pitch to accommodate higher I/O bus requirements, which limits bus frequencies and bandwidth due to physical design constraints such as line length and impedance changes, and increasing contact pitch leads to signal coupling and cross-talk.
Innovation Solution
A multi-level interconnect apparatus with I/O units on both surfaces of the substrate, allowing for increased bandwidth density by configuring the first I/O unit on one side and the second I/O unit on the opposite side, enabling electrical communication along different dimensions, thereby minimizing physical design limitations and enhancing module performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If increased bus width (additional contacts) is used to meet bandwidth requirements, then bandwidth is improved, but contact pitch decreases and line length increases which limits bus frequency
Solution Approach 1:
The patent utilizes the third dimension (vertical stacking) by implementing multiple I/O units at different levels within the substrate. This allows bandwidth expansion without increasing the planar contact count, thereby avoiding the trade-off between contact pitch and bus frequency. The multi-level interconnect structure enables additional I/O channels to be stacked vertically rather than arranged horizontally.
2Quantity of substance
If contact pitch is reduced to increase bandwidth, then bandwidth is improved, but signal coupling increases which drives cross-talk and limits bus frequency
Solution Approach 1:
By transitioning from a two-dimensional planar arrangement to a three-dimensional multi-level structure, the patent increases the physical separation between signal paths. The vertical stacking of I/O units with intermediate substrate layers provides natural isolation between signals, reducing electromagnetic coupling and cross-talk while maintaining high bandwidth capacity.
3Quantity of substance
If line length is increased to accommodate additional contacts, then contact count increases, but bus frequency is limited due to longer signal paths
Solution Approach 1:
The multi-level interconnect architecture redistributes I/O contacts across multiple vertical layers, shortening the horizontal line length required for each individual contact. The intermediate substrate layers provide localized I/O interfaces that are closer to the processing unit, reducing signal path length and associated delays while maintaining high contact count.
4Quantity of substance
If substrate size is increased to accommodate additional contacts, then contact count increases, but real estate requirements increase and line length increases which limits bus frequency
Solution Approach 1:
The patent exploits the vertical dimension by stacking multiple I/O units and intermediate substrate layers within the same planar footprint. This three-dimensional integration allows high contact count to be achieved without increasing the substrate's planar area, as additional I/O channels are accommodated in the vertical stacking direction rather than expanding the horizontal footprint.
Data Source
AI summary
A multi-level interconnect apparatus includes a substrate including a substrate body having a first side and a second side opposite the first side, a processing unit disposed on the second side of the substrate body, a first input/output (I/O) unit disposed on the first side of the substrate body and configured to be electrically communicable with the processing unit along a thickness dimension of the substrate body and a second I/O unit disposed on the second side of the substrate body and configured to be electrically communicable with the processing unit along a planar dimension of the substrate body.