Multi-Level Interconnect Clip for Semiconductor Top-Side Cooling

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Solution Overview

Problem

Existing semiconductor packages with top-side cooling features do not achieve balanced heat dissipation between the bottom and top sides, requiring costly and time-consuming processing steps like soldering or welding for integration.

Innovation Solution

A semiconductor package design incorporating a multi-level interconnect clip with vertically offset planar segments and supports, allowing for efficient top-side cooling and electrical connection, which is monolithically formed from conductive metal and easily integrated using liquified mold compound, eliminating the need for costly securing methods.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If known top-side cooling features are used, then heat dissipation capacity is improved, but processing complexity and cost increase due to soldering or welding requirements

Engineering Contradiction:

Improveheat dissipation capacityVSAvoidprocessing complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical joining processes (soldering or welding) with a molding process where liquid mold compound flows around and secures the interconnect clip. This substitution eliminates the need for costly and complex thermal processing steps while maintaining secure attachment of the cooling feature to the semiconductor package.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the state of the bonding material from solid (solder or welding material requiring high temperature processing) to liquid mold compound that can be applied at lower temperatures and solidifies upon cooling. This parameter change enables simpler processing while achieving the same securing function.

Inventive Principle:

Principle #35Parameter changes

2Temperature

If known top-side cooling features are used, then cooling capability is improved, but manufacturing time increases due to costly processing steps

Engineering Contradiction:

Improvecooling capabilityVSAvoidmanufacturing time

Core Design Contradiction:

TemperatureVSLoss of time

Solution Approach 1:

The patent replaces time-consuming soldering or welding operations with a faster molding process. The liquid mold compound can be applied and solidified in a single continuous operation, significantly reducing the manufacturing cycle time compared to traditional thermal joining methods that require heating, cooling, and inspection cycles.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Temperature

If dual side cooling package is used, then thermal dissipation capacity is improved, but heat dissipation balance between top and bottom sides is difficult to achieve

Engineering Contradiction:

Improvethermal dissipation capacityVSAvoidheat dissipation balance

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The patent divides the interconnect clip into multiple segments (first segment with exposed upper surface for top-side cooling, second segment with lower surface flush against bond pad for bottom-side connection). This segmentation allows independent optimization of each cooling path while maintaining overall thermal balance through the supporting structure that connects both segments.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent extends the cooling solution into the vertical dimension by creating a multi-level interconnect clip structure where the first segment protrudes above the encapsulant surface for top-side heat dissipation, while the second segment remains at the die level for bottom-side thermal connection. This three-dimensional configuration enables balanced dual-side cooling without compromising electrical connectivity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design provides enhanced top-side cooling capability with a large exposed conductive surface for heat dissipation and stable integration, reducing processing complexity and costs while maintaining mechanical stability and efficient heat transfer.

Implementation Method 1

The interconnect clip provides an exposed upper surface that is exposed from an upper surface of the encapsulant, allowing for efficient top-side cooling and heat dissipation

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

easily integrated using liquified mold compound

Methodology Applied

Scientific EffectFluid flow:

Data Source

PatentUS10978380B2Semiconductor package with multi-level conductive clip for top side cooling

Publication Date: 2021.04.13 INFINEON TECHNOLOGIES AG

AI summary

A semiconductor package includes a die pad having a die attach surface, a semiconductor die mounted on the die attach surface and having a first bond pad at an upper surface facing away from the die attach surface, an interconnect clip, having a first segment which at least partially encloses a central opening, a second segment vertically offset and spaced apart from the first segment, and one or more supports connected between the first segment and the second segment, and an electrically insulating encapsulant covering the semiconductor die. An upper surface of the first segment of the interconnect clip is exposed from an upper surface of the encapsulant. A lower surface of the second segment is flush against the first bond pad.