Multi-Level MEMS Actuator Fabrication for Sensing

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Solution Overview

Problem

Current MEMS sensor designs face limitations in creating complex geometries due to space constraints, which affects their ability to accurately capture and measure various types of motion and orientations in applications such as gaming, navigation, and safety systems.

Innovation Solution

A method for fabricating multi-level MEMS sensors involves creating an actuator layer with sacrificial and handle layers, where multi-level features extend from the actuator layer through openings in the sacrificial layer, allowing for differential sensing and enhanced geometries such as out-of-plane movement detection and protection against large displacements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional planar MEMS geometries are used, then manufacturing is simpler, but measurement sensitivity and protection of inertial components are reduced

Engineering Contradiction:
Improvemeasurement sensitivityVSAvoidgeometry complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent transitions from traditional planar (2D) MEMS geometries to multi-level (3D) structures by adding vertical dimensionality. The actuator layer is bonded to both a handle layer and a substrate layer, creating intra-layer cavities that enable out-of-plane movement detection and multi-level feature configurations, thereby increasing measurement sensitivity while managing geometric complexity through systematic layering.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements nested structures where multi-level features are formed within the actuator layer by creating intra-layer cavities. These cavities are formed by depositing sacrificial material, forming features above it, then removing the sacrificial material. This nesting approach allows complex 3D geometries to be built systematically within the constrained space between the handle and substrate layers.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Measurement precision

If multi-level features are added to increase measurement sensitivity, then sensing capability improves, but device complexity increases

Engineering Contradiction:
Improvesensing capabilityVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent segments the MEMS device into distinct functional layers: a handle layer for support, an actuator layer containing the inertial components and multi-level features, and a substrate layer for integration. This segmentation allows complex multi-level features to be isolated and managed within the actuator layer, reducing overall device complexity while maintaining enhanced sensing capability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces sacrificial material as an intermediary element during fabrication. This sacrificial material is deposited on the actuator layer, used to define the geometry of intra-layer cavities, then removed to create the final multi-level structure. This intermediary approach simplifies the fabrication process of complex geometries by providing a temporary structural guide.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Adaptability or versatility

If out-of-plane movement detection is implemented, then measurement capability is enhanced, but manufacturing complexity increases

Engineering Contradiction:
Improvemeasurement capabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent creates a multi-functional actuator layer that can detect both in-plane and out-of-plane movements through its multi-level feature configuration. The same actuator layer structure serves multiple sensing functions, eliminating the need for separate detection mechanisms and thereby reducing manufacturing complexity despite the enhanced measurement capability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent performs preliminary fabrication actions by bonding the actuator layer to the handle and substrate layers before creating the intra-layer cavities. This sequence allows the multi-level features to be formed in a pre-positioned structure, simplifying subsequent manufacturing steps compared to attempting to create cavities first and then add structural layers.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables increased measurement sensitivity, improved protection of inertial components, and better noise rejection, facilitating more complex sensor designs that can accurately detect orientations and movements in diverse applications.

Implementation Method 1

receiving a first sense signal representative of a first capacitance between a first planar surface of an actuator layer and a sense electrode of a multi-level feature that faces the first planar surface. The method may further comprise receiving a second sense signal representative of a second capacitance between a second planar surface of the actuator layer and a substrate layer

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS20240351864A1Multi-level MEMS process
Publication Date: 2024.10.24 INVENSENSE INC
  • US20240351864A1 patent drawing
  • US20240351864A1 patent drawing
  • US20240351864A1 patent drawing

AI summary

An actuator layer of a MEMS sensor is be fabricated to include multi-level features, such as additional sense electrodes, vertical bump stops, or weighted proof masses. A sacrificial layer is deposited on the actuator layer such that locations are provided for the multi-level features to extend vertically from the actuator layer. After the multi-layer features are fabricated on the actuator layer the sacrificial layer is removed. Additional processing such as patterning of the actuator layer may be performed to provide desired functionality and electrical signals to portions of the actuator layer, including to the multi-level features.