Multi-level Power Amplifier with Impedance Matching Interface
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Solution Overview
Problem
Existing electrical systems with multiple integrated circuits face challenges such as high energy loss, large size, and high cost due to the need for complex power combiners and splitters, particularly when transitioning power from MMICs to waveguides, which is problematic in applications like satellites where space and weight are critical.
Innovation Solution
A multi-level electrical system with integrated circuits connected via an impedance matching interface, using a step launch transition and heat pipes for efficient heat dissipation, and employing multiple chassis in parallel planes to combine and split power signals, reducing energy loss and size while maintaining thermal efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional power combiners are used to combine power from multiple MMICs, then power combining is achieved, but the system becomes large, heavy, and expensive
Solution Approach 1:
The patent combines multiple MMICs and their power combining functions into a single integrated circuit package. The power combiner functionality is merged directly with the MMICs on the same substrate, eliminating the need for separate external power combiner components. This integration directly reduces system weight while maintaining power combining capability.
Solution Approach 2:
The patent embeds the power combining functionality within the MMIC structure itself. The power combining network is nested inside the integrated circuit package, with signal paths routed through internal layers and structures. This nesting approach consolidates multiple functions into a compact form factor, reducing overall system weight.
2Power
If traditional power combiners are used to combine power from multiple MMICs, then power combining is achieved, but the system size increases
Solution Approach 1:
The patent merges the power combining network with the MMIC substrate, eliminating the need for separate external combiner components. This integration dramatically reduces the system footprint by consolidating multiple discrete components into a single integrated package.
Solution Approach 2:
The patent utilizes three-dimensional integration techniques, routing power and signal paths through vertical layers and via holes in the substrate. This dimensional approach allows compact power combining functionality to be achieved within a small planar footprint by exploiting the third dimension (depth/height) of the integrated circuit structure.
3Loss of energy
If impedance matching interfaces are added to reduce energy loss, then signal loss is reduced, but device complexity increases
Solution Approach 1:
The patent integrates impedance matching networks directly into the MMIC substrate alongside the power combining functionality. By merging these functions into a single integrated structure, the patent reduces the number of discrete components and interconnections required, thereby lowering overall device complexity while achieving effective impedance matching to minimize signal loss.
4Power
If multiple separate circuits are used to achieve high power output, then desired power level is achieved, but system cost increases
Solution Approach 1:
The patent combines multiple MMICs and power combining functions into a single integrated circuit package that can be manufactured as one unified device. This integration enables economies of scale in manufacturing, reducing per-unit costs compared to assembling multiple separate high-power circuits. The unified structure simplifies production testing, quality control, and assembly operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves minimal signal loss and compact size by directly connecting multiple MMICs to a waveguide through an impedance matching interface, reducing the overall footprint and weight, and enhancing thermal efficiency, making it suitable for applications like satellites.
Implementation Method 1
connected to a waveguide or other energy transition device by an impedance matching interface
Implementation Method 2
employing multiple chassis in parallel planes to combine and split power signals, reducing energy loss and size while maintaining thermal efficiency
Data Source
AI summary
In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.