Multi-Level RF Inductor Structure for High Q Package Integration
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Solution Overview
Problem
Integrated circuit device packaging faces challenges in optimizing multiple parameters, particularly the performance of passive electronic components like inductors and capacitors due to proximity to a ground plane, which affects the quality factor Q and introduces series inductance, making it difficult to balance thickness for active and passive dies.
Innovation Solution
A multi-level RF integrated circuit component structure with a lower level providing adequate distance from the ground plane, using conductive elements like bond pads at multiple levels to reduce series inductance and capacitive coupling, allowing for low inductance connections between passive and active dies, and incorporating a non-conductive material like glass or ceramic with voids to enhance inductance quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the passive device is placed close to the ground plane to reduce package thickness, then the overall device thickness is reduced, but the quality factor Q of the inductor deteriorates due to increased capacitive coupling
Solution Approach 1:
The patent transitions from a single-plane layout to a three-dimensional multi-level structure. The passive device is positioned on an upper level while the ground plane remains on a lower level, separated by an intermediate substrate. This vertical stacking approach reduces the horizontal footprint and allows for thinner overall packaging while maintaining adequate electrical isolation between the passive device and ground plane through the intermediate substrate material.
2Reliability
If the distance between the passive device and ground plane is increased to improve quality factor Q, then the inductance quality improves, but series inductance increases due to longer connection paths
Solution Approach 1:
An intermediate substrate is introduced as a mediator between the passive device and the ground plane. This intermediate substrate serves multiple functions: it provides electrical isolation to maintain high quality factor Q by reducing capacitive coupling, while also providing a structured pathway for conductive connections that minimize series inductance. The intermediate substrate acts as a bridge that reconciles the conflicting requirements of electrical isolation and low-inductance connectivity.
3Reliability
If a multi-level structure with intermediate substrate is used to separate passive device from ground plane, then quality factor Q improves, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into the intermediate substrate: electrical isolation, mechanical support, and connection pathway provision. By merging these functions into a single component rather than using separate elements for each function, the design achieves the desired electrical performance while minimizing the increase in overall structural complexity. The intermediate substrate integrates the isolation and connection functions in a unified structure that simplifies the overall device architecture.
Data Source
AI summary
A multi-level radio frequency (RF) integrated circuit component includes an upper level including at least one inductor, and a lower level including at least one conductive element that provides electrical connection to the at least one inductor. The lower level separates the at least one inductor from a lower surface that is configured to be attached to a conductive pad. Related integrated circuit device packages are also discussed.