Multi-level Semiconductor Package with Planar Connector
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages with all leads at the same level limit electrical and thermal performance and interconnect placement, necessitating new connection technologies with improved thermal and electrical conductivity.
Innovation Solution
The semiconductor package design features leads that terminate at different levels, utilizing a single continuous planar connector to connect semiconductor die electrodes to leads at the same level, enhancing electrical and thermal performance and design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If all leads are positioned at the same level in conventional molded packages, then the package structure is simple and easy to manufacture, but the electrical and thermal performance is limited and interconnect placement flexibility is restricted
Solution Approach 1:
The patent introduces multi-level lead arrangement where leads terminate at different vertical levels within the package. This dimensional change from a single-plane lead configuration to a multi-level three-dimensional arrangement enables improved electrical and thermal performance by allowing larger connection areas and better heat dissipation paths, while the connector design maintains manufacturing feasibility through planar construction at each level.
Solution Approach 2:
The package structure is segmented into multiple levels with leads terminating at different heights. The connector is divided into multiple planar sections, each connecting die electrodes to leads at the corresponding level. This segmentation allows optimization of electrical and thermal connections at each level independently while maintaining overall structural coherence.
2Reliability
If metal clips are used to provide large-area connections between package leads and die electrodes, then electrical and thermal properties improve, but interconnect placement flexibility is reduced due to conventional single-level lead arrangement
Solution Approach 1:
By extending leads to multiple vertical levels within the package, the invention creates additional placement zones for interconnects. This multi-level arrangement provides greater flexibility in positioning connectors and die electrodes while maintaining large-area planar connections, thereby improving both electrical/thermal conductivity and design versatility simultaneously.
Solution Approach 2:
The leads are pre-positioned at different levels within the package structure before die attachment. This preliminary arrangement of leads at multiple heights enables flexible placement of die and connectors subsequently, as the multi-level lead configuration is already established to accommodate various interconnect placement requirements.
3Reliability
If conventional wire bonds are used for electrical connections, then the package structure is simple, but electrical and thermal conductivity is insufficient compared to metal clips
Solution Approach 1:
The invention transitions from single-level wire bond or metal clip connections to multi-level planar connector arrangements. Each connector section maintains the simplicity of planar construction similar to conventional methods, while the multi-level configuration collectively achieves superior electrical and thermal conductivity through increased connection area and optimized thermal paths.
Data Source
AI summary
A semiconductor package includes a semiconductor die having a first electrode at a first side and a second electrode at a second side opposing the first side, a first lead under the semiconductor die and connected to the first electrode at a first level of the package, and a second lead having a height greater than the first lead and terminating at a second level in the package above the first level, the second level corresponding to a height of the semiconductor die. A connector of a single continuous planar construction over the semiconductor die and the second lead is connected to both the second electrode and the second lead at the same second level of the package.