Multi-Level Stacked Redistribution Package for Thinner Form Factor
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Solution Overview
Problem
Current package designs are limited in achieving a thinner and more compact form factor due to the thickness of substrates and the inefficiencies in electrical current paths between discrete devices, which affects performance and structural stability.
Innovation Solution
The implementation of multiple redistribution portions with thinner dielectric layers and redistribution interconnects, allowing for a more compact package structure and improved electrical connectivity, along with encapsulation layers that house discrete devices to enhance structural stability and reduce warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional substrates are used in package design, then structural support is provided, but the package thickness and overall size increase
Solution Approach 1:
The substrate is divided into multiple thin dielectric layers (first dielectric layer, second dielectric layer, third dielectric layer) separated by redistribution portions. This segmentation allows the total substrate thickness to be reduced while maintaining structural integrity through the distributed layer structure.
Solution Approach 2:
The patent introduces vertical stacking of redistribution portions between dielectric layers, transitioning from a planar substrate structure to a multi-level three-dimensional architecture. This enables shorter current paths and reduced package thickness while maintaining electrical connectivity.
2Loss of energy
If traditional substrate designs are used, then manufacturing simplicity is maintained, but electrical current paths between discrete devices become inefficient and parasitic losses increase
Solution Approach 1:
The patent implements multi-level vertical stacking of redistribution portions, creating three-dimensional current paths that significantly shorten the distance between discrete devices. This dimensional transition reduces parasitic inductance and resistance while enabling more efficient electrical connectivity.
Solution Approach 2:
Different dielectric layers are assigned different material properties and thicknesses optimized for specific functions. For example, the first dielectric layer has different characteristics than the second and third layers, allowing local optimization of electrical performance and signal integrity in different regions of the package.
3Length of moving object
If multiple redistribution portions with thinner dielectric layers are implemented, then package thickness is reduced and electrical performance is improved, but manufacturing complexity increases
Solution Approach 1:
The substrate fabrication is segmented into discrete, repeatable steps for forming each dielectric layer and redistribution portion. This modular approach, where layers are built sequentially (first dielectric layer, then first redistribution portion, then second dielectric layer, etc.), makes the complex multi-level structure manufacturable through standardized sequential processing.
Solution Approach 2:
Each dielectric layer is formed with preliminary patterning and preparation steps before subsequent redistribution portions are added. This preliminary action ensures that each layer is properly prepared in advance, reducing manufacturing defects and simplifying the overall fabrication process despite the multi-level complexity.
Data Source
AI summary
A package that includes a first redistribution portion, a second redistribution portion, a third redistribution portion, a first encapsulation layer coupled to the first redistribution portion and the third redistribution portion, a first discrete device encapsulated by the first encapsulation layer, wherein the first discrete device is located between the first redistribution portion and the third redistribution portion, a second encapsulation layer coupled to the first redistribution portion and the second redistribution portion, and a second discrete device encapsulated by the second encapsulation layer, wherein the second discrete device is located between the first redistribution portion and the second redistribution portion.