Multi-Level Optical Waveguide Vertical Interconnect

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Solution Overview

Problem

Existing optoelectronic structures with single-level optical waveguides are inefficient and costly for communicating light signals between optical devices at different levels on a chip, as they only allow communication between devices on the same horizontal plane.

Innovation Solution

The development of optoelectronic structures with a multi-level optical waveguide comprising two discrete segments, where a first segment is formed on a first dielectric layer and a second segment extends from the first level to a higher second level, using a trench in a second dielectric layer to create a continuous pathway, with both segments having a higher refractive index than the surrounding dielectric materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If single-level optical waveguides are used, then the structure is simple and manufacturing is easy, but light signals cannot be communicated between optical devices at different levels

Engineering Contradiction:
Improvecapability to communicate between different levelsVSAvoidwaveguide structure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent transitions from single-level (2D) waveguide structures to multi-level (3D) waveguide structures by incorporating vertical segments that extend between different horizontal planes. This dimensional change enables light signals to be communicated between optical devices at different levels on the chip, resolving the limitation of planar waveguides while maintaining manufacturing feasibility through established lithographic processes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If multi-level optical waveguides are formed using conventional techniques, then communication between different levels is achieved, but the process is inefficient and costly

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidmanufacturing cost
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The waveguide is divided into discrete segments positioned at different levels, with each segment formed through separate lithographic and etching processes. The first waveguide segment is formed at a first level, and the second waveguide segment is formed at a second level, allowing each segment to be optimized and fabricated independently using standard semiconductor manufacturing techniques, thereby improving productivity and reducing costs.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces an intermediary structure (the vertical connection between levels) that enables efficient light signal transmission between different horizontal planes. This intermediary mechanism allows the waveguide to transition between levels while maintaining optical coupling, achieving multi-level communication through a controlled intermediate transition rather than direct complex routing.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If waveguide segments have higher refractive index than surrounding materials, then light signal transmission is proper and efficient, but material selection and fabrication become more constrained

Engineering Contradiction:
Improvelight signal transmission qualityVSAvoidmaterial fabrication ease
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent utilizes refractive index contrast as a key parameter to ensure proper light signal transmission. By selecting materials with appropriate refractive indices (core material with higher refractive index than cladding material), the waveguide segments achieve efficient optical confinement and transmission. This parameter optimization is achieved through standard material deposition and deposition processes, balancing transmission quality with manufacturing feasibility.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient and cost-effective communication of light signals between optical devices at different levels on a chip, ensuring proper transmission by maintaining a higher refractive index for the waveguide segments, thus overcoming the limitations of single-level waveguides.

Implementation Method 1

Both the core and the cladding comprise light-transmissive materials (e.g., light-transmissive dielectric materials); however, the core material(s) have a refractive index that is higher than that of the cladding material(s) so that light signals received by the optical waveguide are confined to and propagated along the core

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS9703036B2Optoelectronic structures having multi-level optical waveguides and methods of forming the structures
Publication Date: 2017.07.11 GLOBALFOUNDRIES US INC
  • US9703036B2 patent drawing
  • US9703036B2 patent drawing
  • US9703036B2 patent drawing

AI summary

Disclosed are structures with an optical waveguide having a first segment at a first level and a second segment extending between the first level and a higher second level and further extending along the second level. Specifically, the waveguide comprises a first segment between first and second dielectric layers. The second dielectric layer has a trench, which extends through to the first dielectric layer and which has one side positioned laterally adjacent to an end of the first segment. The waveguide also comprises a second segment extending from the bottom of the trench on the side adjacent to the first segment up to and along the top surface of the second dielectric layer on the opposite side of the trench. A third dielectric layer covers the second segment in the trench and on the top surface of the second dielectric layer. Also disclosed are methods of forming such optoelectronic structures.