Multi-Loop Heat Dissipation Module for Thin Device Cooling
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Solution Overview
Problem
Existing heat dissipation modules in portable electronic devices face challenges in efficiently dissipating heat within limited space while maintaining performance, particularly in devices trending towards lightness and thinness, leading to potential overheating and circuit crashes.
Innovation Solution
A multi-loop cycling heat dissipation module with independent loops and thermal contact zones between high- and low-temperature sections, utilizing phase transformation of working fluids to enhance heat transfer and provide additional dissipation paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a water-cooled heat dissipation module is used to improve heat dissipation efficiency, then heat dissipation performance is improved, but the device occupies more space and increases in weight
Solution Approach 1:
The patent implements nested loops where the second loop is positioned inside the first loop, and the third loop is positioned inside the second loop. This nested arrangement allows multiple heat dissipation pathways to be contained within a compact volume, maximizing heat dissipation efficiency while minimizing space occupation. The working fluids in different loops can independently circulate through their respective pathways, providing redundant heat dissipation capacity without requiring additional external space.
Solution Approach 2:
The patent transitions from traditional planar or linear heat dissipation arrangements to a three-dimensional nested loop configuration. By utilizing vertical stacking and radial positioning of multiple loops, the system creates additional spatial dimensions for heat transfer pathways. This dimensional transformation enables the heat dissipation module to achieve higher heat dissipation capacity within a smaller footprint by exploiting the third dimension (height/depth) rather than merely expanding in planar area.
2Weight of moving object
If the electronic apparatus is made lighter and thinner, then portability is improved, but heat dissipation capacity is reduced leading to overheating
Solution Approach 1:
The patent utilizes phase transition of the working fluid (evaporation and condensation) as the primary heat transfer mechanism. The working fluid absorbs latent heat during evaporation at the heat source and releases latent heat during condensation at the heat dissipation components. This phase transition mechanism provides extremely high heat dissipation capacity per unit mass of working fluid, enabling effective heat dissipation in a lightweight configuration without requiring large quantities of cooling fluid or heavy heat sinks.
Solution Approach 2:
The patent employs hydraulic principles by using liquid working fluid circulation through closed loops to transfer heat. The system utilizes the fluid's density differences created by temperature variations (natural convection) or controlled pumping to drive circulation. This hydraulic approach enables efficient heat transport through the narrow channels of the nested loops, achieving high heat dissipation capacity in a compact, lightweight structure that does not rely on heavy mechanical cooling components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module effectively improves overall heat dissipation capacity by equalizing temperatures and providing additional heat dissipation paths, preventing heat accumulation and ensuring efficient heat transfer to the external environment.
Implementation Method 1
A first working fluid fills the first loop to transfer heat via phase transformation
Implementation Method 2
transfer heat via phase transformation
Implementation Method 3
transfer heat via phase transformation
Implementation Method 4
the first high-temperature section is in thermal contact with the second low-temperature section, and the first low-temperature section is in thermal contact with the second high-temperature section
Data Source
AI summary
A multi-loop cycling heat dissipation module including a first tank, a first pipe, a second tank, and a second pipe is provided. The first pipe is connected to the first tank to form a first loop, a first working fluid fills the first loop to transfer heat via phase transformation, and a first high-temperature section and a first low-temperature section are formed on the first pipe. The second pipe is connected to the second tank to form a second loop, a second working fluid fills the second loop to transfer heat via phase transformation, and a second high-temperature section and a second low-temperature section are formed on the second pipe. The first high-temperature section is in thermal contact with the second low-temperature section, and the first low-temperature section is in thermal contact with the second high-temperature section.