Multi-Loop Phase-Change Cooling Module for Thin Electronics
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Solution Overview
Problem
Existing heat dissipation modules in portable electronic devices face challenges in efficiently dissipating heat within limited space while maintaining performance, particularly in devices trending towards lightness and thinness, leading to potential overheating and circuit crashes.
Innovation Solution
A multi-loop cycling heat dissipation module with independent loops and thermal contact zones between high- and low-temperature sections, utilizing phase transformation of working fluids to enhance heat transfer and provide additional dissipation paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a water-cooled heat dissipation module is used to improve heat dissipation efficiency, then heat dissipation performance is improved, but device weight and volume increase
Solution Approach 1:
The heat dissipation system is divided into multiple independent loops (first loop with first working fluid, second loop with second working fluid), each capable of operating autonomously. This segmentation allows the system to achieve effective heat dissipation through distributed thermal management rather than requiring a single heavy water-cooling system
Solution Approach 2:
The patent utilizes phase transformation of working fluids (changing from liquid to vapor and back) to enhance heat transfer efficiency. By changing the physical state parameter of the working fluid, the system achieves high heat dissipation capacity without requiring large amounts of cooling medium
2Weight of moving object
If the electronic apparatus is made lighter and thinner, then portability is improved, but heat dissipation capacity deteriorates
Solution Approach 1:
The heat dissipation modules are arranged in a nested or integrated configuration within the electronic apparatus body. The multiple loops are configured to occupy minimal space while maximizing heat dissipation surface area, allowing the system to maintain lightness and thinness without sacrificing heat dissipation capacity
Solution Approach 2:
The system employs phase transformation of working fluids (liquid-vapor transitions) within compact heat dissipation modules. This phase change mechanism enables high heat dissipation efficiency in a small volume, allowing the electronic apparatus to be made lighter and thinner while maintaining adequate heat dissipation capacity
3Reliability
If multiple independent loops are used to improve heat dissipation capacity, then heat dissipation efficiency is improved, but system complexity increases
Solution Approach 1:
The high-temperature section of one loop is thermally coupled with the low-temperature section of another loop, merging the functions of multiple loops into an integrated thermal management system. This reduces the need for separate heat dissipation paths and simplifies the overall system structure while maintaining high heat dissipation capacity
Solution Approach 2:
The thermal contact between high-temperature sections and low-temperature sections of different loops acts as an intermediary heat transfer mechanism. This intermediary coupling allows heat to be transferred between loops without requiring complex control systems or additional components, thereby reducing system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module effectively improves overall heat dissipation capacity by equalizing temperatures and providing additional heat dissipation paths, preventing heat accumulation and ensuring efficient heat transfer to the external environment.
Implementation Method 1
A first working fluid fills the first loop to transfer heat via phase transformation
Implementation Method 2
A second working fluid fills the second loop to transfer heat via phase transformation
Implementation Method 3
The first high-temperature section is in thermal contact with the second low-temperature section, and the first low-temperature section is in thermal contact with the second high-temperature section
Data Source
AI summary
A multi-loop cycling heat dissipation module including a first tank, a first pipe, a second tank, and a second pipe is provided. The first pipe is connected to the first tank to form a first loop, a first working fluid fills the first loop to transfer heat via phase transformation, and a first high-temperature section and a first low-temperature section are formed on the first pipe. The second pipe is connected to the second tank to form a second loop, a second working fluid fills the second loop to transfer heat via phase transformation, and a second high-temperature section and a second low-temperature section are formed on the second pipe. The first high-temperature section is in thermal contact with the second low-temperature section, and the first low-temperature section is in thermal contact with the second high-temperature section.