Multi-Material Additive Manufacturing With In-Process Sintering
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Solution Overview
Problem
Existing additive manufacturing processes for components made of multiple materials face challenges in achieving stability and require additional, potentially damaging thermal treatments like sintering, which can cause thermal deformation.
Innovation Solution
A method involving layer-by-layer application of a first and second material, where the second material is applied while the first material is above its sintering temperature, allowing the second material to be incorporated into the first, thereby eliminating the need for separate thermal treatments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate sintering process is used to fuse electrically conductive particles, then the conductive structure is formed, but thermal deformation of the carrier occurs
Solution Approach 1:
The patent combines the sintering process with the additive manufacturing process by maintaining the build plate temperature above the sintering temperature during material deposition. This allows the conductive particles to be sintered in-situ as the component is being built, eliminating the need for a separate post-processing sintering step that would expose the entire carrier to high temperatures and cause deformation.
Solution Approach 2:
The build plate is preheated to a temperature above the sintering temperature of the conductive material before additive manufacturing begins. This preliminary heating creates a thermal environment that enables sintering to occur during the deposition process itself, rather than requiring a separate high-temperature treatment after the entire component is manufactured.
2Stability of the object's composition
If multiple separate processes are used to produce multi-material components, then material stability is improved, but process complexity increases
Solution Approach 1:
The patent merges multiple manufacturing operations into a single additive manufacturing process. By maintaining the build plate at elevated temperature throughout the printing process, the system simultaneously deposits and sinters materials in one continuous operation, eliminating the need for separate sintering, heating, or post-processing steps while maintaining material stability.
Solution Approach 2:
The build plate serves multiple functions: it acts as the substrate for material deposition, provides thermal energy for sintering conductive particles, and maintains the thermal environment necessary for material bonding. This multi-functionality eliminates the need for separate heating devices or post-processing equipment, simplifying the overall process while ensuring material stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a stable component with enhanced mechanical strength and reduced interface weakness, achieved through direct integration of materials without additional processing steps, thus simplifying and gentler production.
Implementation Method 1
the second material is applied in a state below its solidification point onto the first material in a state above its sintering temperature
Data Source
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AI summary
Described is a method for manufacturing a component by means of an additive manufacturing method, the component being constructed from a first material (12) and from a second material (14) that differs from the first material (12), the method comprising the following steps: • a) building up the component layer by layer by means of the locally delimited application of the first material (12) and of the second material (14) onto a support surface; wherein • b) the layer-by-layer building up of the component by means of the locally delimited application of the first material (12) and of the second material (14) onto a support surface corresponds to the geometry of the component to be manufactured, wherein • c) the first material (12) and the second material (14) are at least partly applied onto the support surface in such a manner that the second material (14) is at least partly in contact with the first material (12) if the first material (12) has a temperature in a range of ≥ 100°C.