Multi-Material Mesh Generation from Voxel Data

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Solution Overview

Problem

The increasing complexity of semiconductor fabrication processes, particularly at advanced technology nodes, leads to lengthy and costly experimental runs in the trial-and-error development of integrated process flows, resulting in significant resource expenditure and inefficiency.

Innovation Solution

A virtual fabrication environment employing a mesh generation pipeline that generates high-quality triangle surface and tetrahedral volume meshes from multi-material fill-fraction voxel data, using Delaunay triangulation and feature graph processing to accurately model semiconductor devices, thereby reducing the need for physical experimentation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If trial-and-error physical experimentation is used to develop semiconductor fabrication processes, then process development can be performed with physical validation, but the cost and duration of development increase significantly

Engineering Contradiction:
Improveprocess validation accuracyVSAvoidprocess development duration
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent creates virtual copies of semiconductor fabrication processes through 3D structural models that replicate physical fabrication outcomes. These virtual models allow process development and validation without physical experimentation, reducing development time while maintaining predictive accuracy through geometric modeling instructed by fabrication physics

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The patent replaces physical mechanical experimentation with computational modeling. Instead of physically fabricating and measuring experimental wafers, the system uses 3D structural models and virtual fabrication environments to predict process outcomes, substituting physical measurement systems with computational prediction systems

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If trial-and-error physical experimentation is used to develop semiconductor fabrication processes, then process assumptions can be validated physically, but resource expenditure increases significantly

Engineering Contradiction:
Improveprocess assumption verificationVSAvoiddevelopment resource cost
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent uses virtual 3D structural models as copies of physical fabrication processes to validate process assumptions. These virtual models enable repeated testing and validation without consuming physical materials or fabrication resources, eliminating the need for expensive experimental wafers while maintaining verification capability

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The virtual fabrication environment enables self-validation of process assumptions through automated 3D structural modeling. The system independently predicts fabrication outcomes based on input parameters and process models, eliminating the need for external physical experimentation and resource-intensive validation cycles

Inventive Principle:
Principle #25Self-service

3Productivity

If conventional CAD and TCAD environments are used for virtual modeling, then some process prediction capability is provided, but the ability to model complete 3D structures of integrated process flows is insufficient

Engineering Contradiction:
Improvemodeling speedVSAvoidintegrated process flow modeling capability
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent segments the complex integrated process flow into discrete 3D structural modeling components that can be individually simulated and then integrated. Each process step generates specific 3D structural changes that are combined to form complete integrated process models, enabling both speed and complexity handling

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from 2D planar modeling to comprehensive 3D structural modeling to capture the full complexity of integrated process flows. This dimensional enhancement allows accurate representation of vertical structures, multi-layer interactions, and three-dimensional material distributions that conventional 2D environments cannot model

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Adaptability or versatility

If 3D structural modeling is performed at circuit-level area scale, then full technology modeling capability is achieved, but computational complexity increases

Engineering Contradiction:
Improvefull technology suite modeling capabilityVSAvoidcomputational model complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent changes the fundamental parameters of modeling by using geometric descriptions instructed by physics rather than full physics-based simulations. This parameter transformation maintains modeling versatility for full technology suites while reducing computational complexity through simplified geometric representations that capture essential physical behavior

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS12086520B2System and method for multi-material mesh generation from fill-fraction voxel data
Publication Date: 2024.09.10 COVENTOR INC
  • US12086520B2 patent drawing
  • US12086520B2 patent drawing
  • US12086520B2 patent drawing

AI summary

Systems and methods for multi-material mesh generation from fill-fraction voxel model data are discussed. Voxel representations of model data are used to generate robust and accurate multi-material meshes. More particularly, a mesh generation pipeline in a virtual fabrication environment is described that robustly generates high-quality triangle surface and tetrahedral volume meshes from multi-material fill-fraction voxel data. Multi-material topology is accurately captured while preserving characteristic feature edges of the model.