Multi-Memory SoC Interface Layout for Flexible Die Packaging
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Solution Overview
Problem
Existing die packages require multiple configurations for different memory devices, leading to increased manufacturing complexity and cost due to the need for various SoC versions.
Innovation Solution
A system-on-a-chip (SoC) with multiple physical layer interfaces that can be configured to connect to different memory devices, including both internal and external configurations, and power management through a power control device to enable or disable interfaces as needed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple SoC versions are designed and manufactured for different memory configurations, then each specific memory configuration requirement is met, but manufacturing complexity and cost increase
Solution Approach 1:
The patent implements a universal SoC design that can support multiple memory configurations (LPDDR4, LPDDR4X, LPDDR5, GDDR6, HBM2, HBM2E) through a single device by incorporating multiple physical layer interfaces and configuration options. This eliminates the need to manufacture separate SoC versions for each memory type, thereby reducing manufacturing complexity while maintaining adaptability across different memory configurations.
Solution Approach 2:
The SoC employs dynamic configuration capabilities where physical layer interfaces can be selectively enabled or disabled based on the required memory configuration. The device can adapt its operational state to match different memory types and package configurations (POP, SiP, external), allowing a single static hardware design to fulfill multiple dynamic configuration requirements without increasing manufacturing complexity.
2Adaptability or versatility
If multiple SoC versions are designed and manufactured for different memory configurations, then each specific memory configuration requirement is met, but cost increases
Solution Approach 1:
By designing a universal SoC that supports multiple memory configurations through integrated physical layer interfaces and configurable parameters, the patent eliminates the need to produce multiple specialized SoC versions. This single-device approach reduces manufacturing costs by consolidating production into one standardized manufacturing process while maintaining the ability to support various memory types including LPDDR4, LPDDR4X, LPDDR5, GDDR6, HBM2, and HBM2E.
3Adaptability or versatility
If multiple physical layer interfaces are included in the SoC for different memory configurations, then support for multiple memory devices is enabled, but device complexity increases
Solution Approach 1:
The patent segments the physical layer interfaces into distinct, independently controllable units within the SoC. Each interface segment can be selectively activated or deactivated based on the specific memory configuration required. This segmentation allows the SoC to present a simplified interface profile for each specific memory type while maintaining the capability to support multiple memory configurations, thereby managing interface complexity through modular organization.
Solution Approach 2:
The SoC implements dynamic interface management where physical layer interfaces can be selectively enabled or disabled through configuration parameters and power control. This dynamic capability allows the system to activate only the necessary interfaces for the current memory configuration, reducing the effective complexity at any given time while maintaining comprehensive support for multiple memory devices including LPDDR4, LPDDR4X, LPDDR5, GDDR6, HBM2, and HBM2E.
4Device complexity
If power is provided to multiple physical layer interfaces over a single power rail, then power management is simplified, but power control precision decreases
Solution Approach 1:
The patent implements dynamic power control where a single power rail can selectively supply power to different physical layer interfaces based on configuration requirements. Through power control devices and gating mechanisms, the system can dynamically enable or disable power delivery to specific interface segments, maintaining simplified power rail architecture while achieving precise power control for individual interfaces. This allows the SoC to support multiple memory configurations with appropriate power management without requiring multiple separate power rails.
Data Source
AI summary
Methods and apparatuses for on-die logic that allow dies, such as a system-on-a-chips (SoCs), to support multiple memory devices in various die configurations. In one example, a die package comprises a first memory device and a system-on-a-chip (SoC). The SoC includes a first plurality of physical layer interfaces electrically connected to the first memory device, wherein the SoC and the first memory device are in a first die package configuration. The SoC also includes a second plurality of physical layer interfaces configured to electrically connect to a second memory device, wherein the SoC and the second memory device are in a second die package configuration In some instances, the first die package configuration is package-on-package (POP), and the second die configuration is system-in-a-package (SiP).