Multi-MEMS Microphone Module Acoustic Hole Layout for Sound Recognition
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Solution Overview
Problem
Existing microphone modules with a single MEMS microphone have poor sound receiving effects, and those with multiple MEMS microphones face issues due to additional front cavities affecting audio loudness, necessitating constraints on structure and spacing that hinder effective sound recognition.
Innovation Solution
A microphone module design featuring at least two MEMS microphones with spaced sound inlet holes, a printed circuit board, and a shell, utilizing conical funnel-type sound pickup holes and sealing rings to enhance sound recognition, with specific hole dimensions and spacings to improve sound pickup and recognition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple MEMS microphones are assembled with outer structural members, then sound receiving capability is improved, but additional front cavities are produced which negatively impact audio loudness
Solution Approach 1:
The patent extracts and eliminates the harmful front cavity structure by directly integrating the sound inlet holes of multiple MEMS microphones into a unified acoustic channel system. The sound pickup holes in the shell and printed circuit board create direct acoustic pathways that bypass the problematic front cavity, thereby removing the source of audio loudness degradation while preserving multi-microphone sound receiving capability.
Solution Approach 2:
The patent introduces sound pickup holes in the shell and printed circuit board as intermediary acoustic channels. These intermediary structures serve as mediators that transmit sound waves directly from the environment to the MEMS microphone diaphragms, replacing the problematic front cavity pathway and enabling effective sound transmission without the harmful acoustic effects.
2Object-generated harmful factors
If constraints are placed on the structure of the front cavity and spacing between MEMS microphone units, then audio loudness is maintained, but device complexity increases
Solution Approach 1:
The patent merges the sound inlet structures of multiple MEMS microphones into a unified acoustic system. By combining the sound pickup functions into integrated holes through the shell and printed circuit board, the design eliminates the need for separate front cavity structures and complex spacing constraints, thereby reducing overall device complexity while maintaining audio performance.
Solution Approach 2:
The sound pickup holes in the shell and printed circuit board serve multiple functions simultaneously: they provide acoustic pathways for all MEMS microphones, maintain audio loudness, and eliminate the need for separate front cavity management. This multi-functionality reduces the number of structural constraints needed compared to traditional designs.
3Device complexity
If a single MEMS microphone is used, then device complexity is reduced, but sound receiving effect deteriorates
Solution Approach 1:
The patent segments the acoustic system into multiple independent sound pickup pathways, each serving a specific MEMS microphone. The shell and printed circuit board are divided with multiple sound pickup holes positioned to correspond with each microphone's sound inlet, creating segmented acoustic channels that enable each microphone to capture sound effectively from its optimal position.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances sound recognition by allowing better sound pickup from different positions, improving the module's ability to capture sounds from various locations, particularly in environments like automobiles.
Implementation Method 1
each of the first sound pickup holes is communicating with the corresponding sound inlet hole and the corresponding second sound pickup hole
Data Source
AI summary
The present disclosure discloses a microphone module including at least two MEMS microphones, a printed circuit board, and a shell, each of the MEMS microphones is provided a sound inlet hole, a plurality of first sound pickup holes are provided on the printed circuit board, a plurality of second sound pickup holes are provided on the shell, each of the first sound pickup holes is communicating with the corresponding sound inlet hole and the corresponding second sound pickup hole, a diameter dimension of each of the first sound pickup holes is D1 mm, a distance between a center axes of adjacent sound inlet holes is greater than or equal to 25D1 mm and less than or equal to 43D1 mm. Compared with the related art, the microphone module disclosed by the present disclosure could have a better sound recognition effect.