Multi-Mixer Chemical Supply for Precision Wafer Cleaning
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Solution Overview
Problem
Conventional cleaning processes for semiconductor substrates struggle to effectively remove particles of 20 nm to 30 nm in size and require different chemical liquid concentrations and flow rates for various substrate surfaces, which existing technologies fail to manage efficiently.
Innovation Solution
A cleaning chemical liquid supply device and method that utilize multiple mixers and dilution water control boxes to adjust the flow rates and concentrations of chemical liquids, allowing for the supply of different types of chemical liquids to specific positions on the substrate, with feedback control to optimize the cleaning process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cleaning processes are used, then the cleaning process is simple, but particles of 20 nm to 30 nm cannot be effectively removed
Solution Approach 1:
The cleaning device is divided into multiple independent mixing units (first mixer, second mixer, third mixer, fourth mixer), each capable of independently controlling chemical liquid concentration and flow rate for different substrate positions, enabling targeted cleaning of particles at various locations
Solution Approach 2:
Different chemical liquid concentrations and compositions are supplied to different positions on the substrate (front surface, back surface, specific regions) based on local contamination characteristics, with each mixer configured to provide optimal cleaning parameters for its designated area
2Manufacturing precision
If different chemical liquid concentrations are used for different substrate positions, then cleaning effectiveness is improved, but the device complexity increases
Solution Approach 1:
The system uses four separate mixing units instead of a single mixing system, allowing each unit to independently control and optimize chemical liquid concentration for specific substrate positions, thereby achieving precise concentration control without requiring a single complex control mechanism
Solution Approach 2:
Multiple mixers are configured to handle different chemical liquids (alkaline and acid types) and supply them to different substrate positions, making each mixer a multi-functional unit that can adapt to various cleaning requirements while maintaining a relatively simple overall structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise control over chemical liquid concentrations and flow rates to effectively clean semiconductor substrates, ensuring thorough cleaning of both surface patterns and reducing particle size concerns, improving the efficiency of the cleaning process.
Implementation Method 1
a first mixer for mixing a first chemical liquid with dilution water, and supplying to a first nozzle for supplying the first chemical liquid adjusted to a desired flow rate and a desired concentration
Implementation Method 2
a third mixer for mixing a second chemical liquid, different from the first chemical liquid, with the dilution water, and supplying to a third nozzle for supplying the second chemical liquid adjusted to a desired flow rate and a desired concentration
Data Source
AI summary
A cleaning chemical liquid supply device includes: first and second mixers respectively mixing first chemical liquid with dilution water and respectively supplying to first and second nozzles respectively supplying the first chemical liquid adjusted to desired flow rates and concentrations to a first position and a second, different position of the substrate in the cleaning device; a first dilution water control box controlling flow rates of the dilution water supplied to the first and second mixers; third and fourth mixers respectively mixing second, different chemical liquid with the dilution water and respectively supplying to third and fourth nozzles for respectively supplying the second chemical liquid adjusted to desired flow rates and concentrations to a third position and a fourth, different position of the substrate in the cleaning device; and a second dilution water control box controlling flow rates of the dilution water supplied to the third and fourth mixers.