Multi-Mode Robot Gripper for Clamping and Adhesive Handling
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Solution Overview
Problem
Current robots with gripping devices are limited to a single gripping mode, which cannot be adapted to various scenarios, leading to inefficiencies and increased complexity in industrial manufacturing and logistics.
Innovation Solution
A gripping device with a casing and at least two gripping assemblies that can switch between a first gripping mode using fingertips for clamping and a second gripping mode using attaching assemblies for adhesion or adsorption, allowing for cooperative gripping of target objects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single gripping mode is used, then the device complexity is reduced, but the adaptability to various scenarios deteriorates
Solution Approach 1:
The gripping device integrates multiple gripping modes (clamping, adhesion, adsorption) into a single device through the gripping assembly that can switch between different gripping methods. The attaching assembly with adhesive layers and the connecting rod assembly enable the same gripper to perform both mechanical clamping and adhesive-based gripping, eliminating the need for separate gripping devices for different object types.
2Adaptability or versatility
If multiple gripping modes are integrated, then the adaptability improves, but the device complexity increases
Solution Approach 1:
The gripping device is segmented into distinct functional modules: the gripping assembly with fingertips for clamping, the attaching assembly with adhesive layers for adhesion, and the connecting rod assembly for mode switching. This modular segmentation allows each component to perform a specific function while working together to achieve multi-mode gripping, making the complex system manageable and maintainable.
Solution Approach 2:
The gripping device employs dynamic switching between gripping modes through the connecting rod assembly that can change the configuration of the gripping components. The mode switching mechanism allows the device to dynamically adapt its gripping method based on the target object characteristics, transitioning between clamping and adhesion modes as needed.
3Force
If mechanical clamping is used, then the gripping force is strong, but the damage to deformable or fragile objects increases
Solution Approach 1:
The invention replaces the purely mechanical clamping system with an adhesive-based gripping system for deformable or fragile objects. The attaching assembly uses adhesive layers that can bond to the object surface without applying concentrated mechanical pressure, thereby providing sufficient gripping force while minimizing damage to sensitive objects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The gripping device can efficiently handle a variety of objects by switching between gripping modes, reducing the complexity and cost of automated systems and minimizing damage to deformable or fragile objects.
Implementation Method 1
the gripping device adheres and/or adsorbs the target object by the attaching assemblies cooperating with each other
Implementation Method 2
the gripping device adheres and/or adsorbs the target object by the attaching assemblies cooperating with each other
Data Source
AI summary
The present disclosure relates to a gripping device includes a casing and at least two gripping assemblies. Each of the gripping assembly includes a fingertip, a connecting rod assembly and an attaching assembly. A first end of the connecting rod assembly is connected to the fingertip, and a second end of the connecting rod assembly is rotatably connected to the casing. The attaching assembly is disposed on a side of the connecting rod assembly facing the target object to be gripped. The gripping device is configured to be switched between a first gripping mode and a second gripping mode. In the first gripping mode, the gripping device clamps the target object by the fingertips cooperating with each other. In the second gripping mode, the gripping device adheres and/or adsorbs the target object by the attaching assemblies cooperating with each other to implement a gripping operation.