Multi-Mode Semiconductor Die With Selectable IO Buffers
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Solution Overview
Problem
Current semiconductor packaging methods are inflexible and costly, as they often require custom designs or reduced interface options, leading to higher production costs and incompatibility with various form factors, while existing solutions either result in excessive pin counts or yield issues.
Innovation Solution
The implementation of multi-mode semiconductor devices with multiple bond pads per IO buffer, allowing for selective connection to package pins via conductive interconnects, enabling the reuse of a standard semiconductor die in various applications with different IO configurations by forming conductive interconnects using processes like deposition and etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If custom semiconductor designs are created for different package types, then compatibility with various form factors is improved, but device complexity and production costs increase
Solution Approach 1:
The patent implements a universal semiconductor die design that can support multiple interface types (e.g., USB 2.0, USB 3.0, SATA) through a single device. The die includes multiple IO buffers that can be selectively activated depending on the target package type, eliminating the need for separate custom designs for each form factor while maintaining compatibility across various applications.
Solution Approach 2:
The invention introduces dynamic configurability through selectably activatable IO buffers that can be enabled or disabled based on the specific package configuration. This dynamic activation allows the same semiconductor die to adapt to different form factors and interface requirements without physical redesign, resolving the contradiction between versatility and complexity.
2Adaptability or versatility
If all interface types are offered on a semiconductor die, then adaptability is improved, but pin count and production costs increase
Solution Approach 1:
The patent implements partial action by providing all necessary interface circuitry on the semiconductor die but only activating the specific interfaces required for each application. Instead of physically connecting all interfaces to package pins, the system uses selective activation of IO buffers to enable only the needed interfaces, thereby reducing pin count while maintaining full adaptability.
Solution Approach 2:
The invention changes the operational parameters of the IO buffers through selective activation. By controlling which IO buffers are enabled via activation signals, the system can dynamically adjust the effective interface configuration to match the specific package type, reducing the number of physical connections needed while preserving all interface capabilities.
3Ease of manufacture
If IO buffers are placed near package pins for optimal bonding, then manufacturing ease is improved, but design flexibility worsens
Solution Approach 1:
The patent makes the IO buffers universal by enabling the same buffer to serve different interface types through selective activation. The IO buffers are positioned for optimal bonding access, and through the activation mechanism, they can be configured to support various interface types (USB 2.0, USB 3.0, SATA, etc.), thereby maintaining both manufacturing ease and design flexibility.
Solution Approach 2:
The invention introduces dynamic configurability to the IO buffer positioning strategy. While the physical position of IO buffers is fixed for optimal bonding, their functional assignment is dynamic - the same physically positioned buffer can be activated to support different interface types based on the target application, resolving the contradiction between manufacturing ease and flexibility.
4Adaptability or versatility
If multiple versions of semiconductor design are produced for different interfaces, then interface compatibility is improved, but productivity and yield decrease
Solution Approach 1:
The patent merges multiple interface implementations into a single semiconductor die design. Instead of producing separate versions of the die for USB 2.0, USB 3.0, SATA, and other interfaces, the invention combines all interface capabilities into one unified design with selectively activatable IO buffers. This single design approach is activated through control signals to support the required interface, thereby improving productivity and yield while maintaining comprehensive interface compatibility.
Data Source
AI summary
Various systems and methods for implementing multi-mode semiconductor devices are discussed herein. For example, a multi-mode semiconductor device is disclosed that includes a device package with a number of package pins. In addition, the device includes a semiconductor die or substrate with at least two IO buffers. One of the IO buffers is located a distance from a package pin and another of the IO buffers is located another distance from the package pin. One of the IO buffers includes first bond pad electrically coupled to a circuit implementing a first interface type and a floating bond pad, and the other IO buffer includes a second bond pad electrically coupled to a circuit implementing a second interface type. In some cases, the floating bond pad is electrically coupled to the circuit implementing the second interface type via a conductive interconnect, and the floating bond pad is electrically coupled to the package pin.