Multi-Module Die Bonder Platform for Semiconductor Delivery

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Solution Overview

Problem

Cascading die bonders in semiconductor package manufacturing have limitations in throughput, require significant space, and are prone to malfunctions due to increased device count and sequential operation, which reduces overall efficiency and increases the likelihood of operational halts.

Innovation Solution

A platform with multiple delivery modules, where support devices are mutually levelled and delivery heads are positioned to reduce travel distance and allow for adjustable configurations, enabling improved throughput and reduced footprint by minimizing the need for precise height adjustments and reducing the likelihood of malfunctions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If cascading die bonders are used to increase throughput, then Units per Hour (UPH) capacity is improved, but device complexity and footprint area increase significantly

Engineering Contradiction:

ImproveUnits per Hour (UPH) capacityVSAvoidnumber of devices

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

Multiple delivery modules are integrated onto a single die bonder platform, sharing common support devices and control systems. This merging approach enables multi-head simultaneous operation to increase UPH without proportionally increasing device complexity, as the modules share infrastructure rather than operating as completely separate units

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The die bonder is divided into multiple independent delivery modules, each capable of independent operation. This segmentation allows parallel processing of multiple substrates simultaneously, increasing throughput while maintaining manageable complexity through modular design where each module can be independently maintained and replaced

Inventive Principle:

Principle #1Segmentation

2Productivity

If cascading die bonders are used to increase throughput, then Units per Hour (UPH) capacity is improved, but footprint area increases

Engineering Contradiction:

ImproveUnits per Hour (UPH) capacityVSAvoidfootprint area

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

Multiple delivery modules are arranged in a vertical or multi-layer configuration rather than linear horizontal arrangement. This dimensional change allows multiple processing stations to occupy overlapping or stacked spatial zones, increasing throughput capacity without proportionally increasing the horizontal footprint area of the equipment

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Productivity

If cascading die bonders are used to increase throughput, then Units per Hour (UPH) capacity is improved, but reliability decreases due to increased malfunction probability

Engineering Contradiction:

ImproveUnits per Hour (UPH) capacityVSAvoidoperational continuity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The support devices are pre-levelled during assembly to ensure precise height alignment before operation begins. This preliminary action eliminates the need for time-consuming height adjustments during substrate conveyance, reducing operational delays and maintaining consistent throughput while minimizing disruptions that could lead to operational halts

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system incorporates adjustable and movable components that allow dynamic adaptation during operation. Delivery modules can be repositioned and reconfigured to optimize performance and bypass potential failure points, maintaining operational continuity even when individual components require maintenance or adjustment

Inventive Principle:

Principle #15Dynamics

4Adaptability or versatility

If support devices with larger widths are used to accommodate larger leadframes, then adaptability is improved, but delivery distance increases reducing UPH

Engineering Contradiction:

Improveleadframe size accommodationVSAvoidUnits per Hour (UPH)

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The delivery modules incorporate adjustable positioning mechanisms that allow the delivery heads to dynamically reposition based on leadframe size. This dynamic adjustment enables the system to accommodate various leadframe dimensions while optimizing delivery paths to minimize travel distance, maintaining high UPH across different substrate sizes

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS8590143B2Apparatus for delivering semiconductor components to a substrate

Publication Date: 2013.11.26 ASMPT SINGAPORE PTE LTD

AI summary

An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually leveled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.