Multi-Module Exposure Apparatus for FO-WLP Rewiring
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Solution Overview
Problem
The existing technologies for forming rewiring layers in Fan Out Wafer Level Packages (FO-WLP) and Fan Out Plate Level Packages (FO-PLP) face challenges in improving throughput during the manufacturing process.
Innovation Solution
An exposure apparatus is designed with a substrate stage and first projection modules incorporating spatial light modulators, such as digital mirror devices (DMDs), which project wiring patterns onto substrates simultaneously, enabling efficient formation of rewiring layers across multiple substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wiring patterns are formed on substrates sequentially using a single projection module, then device complexity is reduced, but productivity deteriorates due to low throughput
Solution Approach 1:
The patent divides the projection system into multiple first projection modules, where each module is responsible for projecting wiring patterns onto a specific substrate. This segmentation allows simultaneous processing of multiple substrates, thereby improving throughput while keeping each individual projection module relatively simple in structure.
Solution Approach 2:
The patent combines multiple projection modules and substrate stages into an integrated exposure apparatus. The multiple projection modules operate simultaneously on multiple substrates, merging their functions to achieve high-throughput production. This combining approach resolves the contradiction by achieving high productivity through parallel processing while maintaining manageable device complexity through modular design.
2Productivity
If multiple projection modules are used to project onto different substrates simultaneously, then productivity is improved, but device complexity increases
Solution Approach 1:
Each first projection module is designed with universal functionality to project wiring patterns onto substrates. The modules share common characteristics and can perform the same function simultaneously on different substrates. This universality allows the system to achieve high productivity through parallel processing while maintaining relatively simple individual module designs, thus managing overall device complexity.
Solution Approach 2:
The patent transitions from sequential processing (single dimension in time) to parallel processing by introducing multiple substrate stages and projection modules. This dimensional expansion allows simultaneous exposure of multiple substrates, dramatically improving throughput. The modular arrangement in space enables this parallel operation while keeping each module's internal structure relatively simple, balancing productivity improvement with device complexity management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly enhances the throughput in forming rewiring layers by allowing simultaneous projection onto multiple substrates, reducing the time required for the process and improving the efficiency of wiring pattern formation.
Implementation Method 1
first projection modules each including a spatial light modulator, the first projection modules projecting wiring patterns each connecting semiconductor chips arranged on each of the substrates onto the substrates
Data Source
AI summary
An exposure apparatus includes a substrate stage on which substrates are placed, and first projection modules each including a spatial light modulator, the first projection modules projecting wiring patterns each connecting semiconductor chips arranged on each of the substrates onto the substrates, wherein the first projection modules project the wiring patterns onto different substrates, substantially simultaneously.