Multi-Module User Equipment Thermal Mitigation via Bandwidth Reallocation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Wireless communication devices face challenges in managing excessive heat generation due to high-frequency communications, leading to reduced performance, device damage, and safety concerns, particularly in user equipment with multiple communication modules.
Innovation Solution
Implementing thermal mitigation techniques that dynamically adjust the configuration of transceiver modules based on operating temperatures, such as transitioning bandwidth monitoring between modules to manage thermal load while maintaining performance, using intra-module and inter-module configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If high-frequency communications are used to increase data rates, then communication performance is improved, but heat generation increases leading to device damage and safety concerns
Solution Approach 1:
The system dynamically adjusts the configuration of transceiver modules based on real-time temperature monitoring. When temperature exceeds thresholds, the system transitions from high-frequency millimeter wave communications to lower-frequency communications, and adjusts bandwidth monitoring configurations between transceiver modules to distribute thermal load dynamically while maintaining communication performance
Solution Approach 2:
The system changes operational parameters of transceiver modules based on temperature conditions. It monitors temperature and adjusts configuration parameters such as bandwidth allocation, frequency band selection, and active module selection to reduce thermal generation when temperature thresholds are exceeded, thereby resolving the contradiction between high data rates and temperature control
2Reliability
If multiple communication modules operate simultaneously to maintain communication performance, then communication reliability is improved, but thermal load increases leading to excessive heat generation
Solution Approach 1:
The system segments the communication functionality across multiple transceiver modules, each capable of independent operation. When thermal load becomes excessive, the system can isolate and deactivate specific modules while maintaining communication through remaining modules, thus reducing thermal load while preserving communication reliability through distributed architecture
Solution Approach 2:
The system uses temperature monitoring and control logic as an intermediary to manage the operation of multiple communication modules. Based on temperature feedback, the system dynamically adjusts which modules are active and how bandwidth is distributed among them, mediating between the need for redundant communication paths and the need to limit thermal generation
Data Source
AI summary
In some aspects, the present disclosure provides methods, apparatuses, and systems for efficient thermal mitigation while maintaining wireless device performance on a primary component carrier (PCC). Embodiments described may include implementation of target transceiver module configurations, where bandwidth (e.g., PCC bands and secondary component carrier (SCC) bands) may be monitored by a wireless device based on intra-module target configurations and/or inter-module target configurations. An intra-module target configuration may include a target transceiver module monitoring both PCC bands and SCC bands. An inter-module target configuration may include or refer to a plurality of target transceiver modules together monitoring PCC bands and SCC bands. In scenarios where operating temperatures exceed temperature thresholds, target transceiver module configurations may be implemented to transition PCC bands, SCC bands, or both, from a PCC-resident transceiver module to another transceiver module to reduce the operating temperatures of concern. Various additional and alternative aspects are described herein.