Multi-node Server Vertical Backplane Node Replacement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing multi-node servers face challenges in rapid node replacement due to the complexity of signal series connections and cable organization, which limits their scalability and efficiency.
Innovation Solution
The proposed multi-node server design incorporates a power delivery circuit board disposed vertically on the main circuit board and a signal transfer module with a signal transfer circuit board oriented parallel to the main circuit board, enabling high-speed signal transmission and facilitating quick node replacement without lengthening the server chassis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If signal wires are used for signal series connection between nodes, then node connectivity is achieved, but the length of signal wires and cable organizing design prevents rapid node replacement
Solution Approach 1:
The patent transitions from horizontal signal wire routing to vertical signal transmission through a vertically disposed backplane circuit board. This dimensional change allows nodes to be connected via vertical interfaces, eliminating the need for long horizontal signal wires and complex cable organization, thereby enabling rapid node replacement while maintaining connectivity.
Solution Approach 2:
The server system is segmented into independent node units that can be individually replaced. The backplane circuit board provides a common signal distribution infrastructure, allowing each node to be modularized with its own signal connectors, power connectors, and interface circuits, facilitating quick swap operations without affecting other nodes.
2Area of stationary object
If a 1U dual-node system architecture is implemented, then space efficiency is improved, but heat dissipation becomes more challenging due to compact configuration
Solution Approach 1:
The patent introduces vertical airflow paths through the compact 1U chassis by disposing the backplane vertically and designing corresponding vertical cooling channels. This three-dimensional cooling architecture allows cool air to enter from the front, flow vertically through heat-generating components, and exhaust from the rear, effectively dissipating heat in the constrained space.
Solution Approach 2:
The patent implements localized cooling solutions with cooling channels positioned adjacent to specific high-heat components such as the backplane and node devices. This targeted cooling approach directs airflow precisely where heat generation is highest, maximizing heat dissipation efficiency in the compact 1U form factor.
Data Source
AI summary
A multi-node server includes a server chassis, a main circuit board, a power delivery circuit board, and a signal transfer module. The main circuit board has a first node area and a second node area. The power delivery circuit board is disposed vertically on the main circuit board. A first side of the power delivery circuit board has a first power input connector and a second power input connector. A second side of the power delivery circuit board has a first power output connector facing the first node area and a second power output connector facing the second node area. The signal transfer module has a signal transfer circuit board, a first signal connector, and a second signal connector. The signal transfer circuit board is parallel to the main circuit board. The signal transfer circuit board electrically connects the first signal connector to the second signal connector.