Multi-Nozzle Evaporation Source for Large-Area Film Uniformity

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing evaporation sources struggle to maintain thickness uniformity of thin films on large-area substrates due to differences in residual deposition material amounts and potential defects, leading to degradation in film quality.

Innovation Solution

The evaporation source employs a crucible with multiple nozzle tips having varying spray angles and opening areas, controlled to uniformly deposit the material across the substrate, and a method to replace sources based on thickness profiles to maintain uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If multiple evaporation sources are used to deposit on large-area substrates, then deposition coverage is improved, but thickness uniformity degrades due to differences in residual material amounts

Engineering Contradiction:

Improvesubstrate coverage areaVSAvoidthin film thickness uniformity

Core Design Contradiction:

Area of stationary objectVSManufacturing precision

Solution Approach 1:

The evaporation source is segmented into multiple independent nozzle units (first nozzle unit, second nozzle unit, etc.), each capable of independent control. This segmentation allows individual adjustment of deposition parameters for each nozzle to compensate for residual material differences, maintaining thickness uniformity across large substrate areas while providing independent control to prevent degradation from material consumption variations.

Inventive Principle:

Principle #1Segmentation

2Manufacturing precision

If output power of evaporation sources is adjusted to compensate for residual material differences, then thickness uniformity is improved, but system complexity increases

Engineering Contradiction:

Improvethin film thickness uniformityVSAvoidpower control system complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The system changes operational parameters (output power, deposition rate) of individual nozzle units based on real-time monitoring of residual material amounts and thickness profiles. By dynamically adjusting these parameters, the system compensates for residual material differences and maintains thickness uniformity without requiring complex structural modifications, using parameter optimization instead of hardware complexity.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If evaporation sources are used for extended periods, then productivity is improved, but thickness uniformity degrades as deposition material is consumed

Engineering Contradiction:

Improvedeposition process continuityVSAvoidthin film thickness uniformity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The system implements feedback control by monitoring thickness profiles during deposition and residual material amounts in real-time. Based on this feedback, the control unit dynamically adjusts the operation of each nozzle unit, compensating for material consumption over time. This allows extended deposition processes to maintain thickness uniformity without requiring frequent source replacement, thus preserving both productivity and manufacturing precision.

Inventive Principle:

Principle #23Feedback

4Device complexity

If a single evaporation source is used, then system simplicity is maintained, but deposition uniformity on large substrates deteriorates

Engineering Contradiction:

Improveevaporation source configurationVSAvoiddeposition thickness uniformity

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The evaporation source is divided into multiple independent nozzle units arranged to cover different regions of the substrate. Each nozzle unit can be independently controlled to deposit material with specific characteristics. This segmentation enables the system to maintain relatively simple overall structure while achieving superior deposition uniformity across large substrate areas through coordinated operation of multiple nozzles.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures consistent film thickness across large-area substrates by adjusting nozzle tip configurations and replacing sources as needed, preventing degradation and ensuring uniform deposition.

Implementation Method 1

a heater configured to heat the crucible

Methodology Applied

Scientific EffectEvaporation: Evaporation

Implementation Method 2

a nozzle member disposed on an upper end of the crucible, wherein the nozzle member includes a plurality of nozzle tips protruding from an upper surface of the nozzle member in a direction in which the deposition material is sprayed

Methodology Applied

Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Data Source

PatentUS20250303427A1Evaporation source, deposition system including the same, and method of replacing evaporation source

Publication Date: 2025.10.02 YAS CO LTD

AI summary

The present disclosure relates to an evaporation source, a deposition system including the same, and a method of replacing the evaporation source. An evaporation source according to one embodiment of the present disclosure includes a crucible having a cylinder shape and configured to accommodate a deposition material, and a nozzle member disposed on an upper end of the crucible, wherein the nozzle member includes a plurality of nozzle tips protruding from an upper surface of the nozzle member in a direction in which the deposition material is sprayed.