Multi-nozzle Organic Vapor Jet Printing for High Resolution

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Solution Overview

Problem

Existing organic vapor jet printing (OVJP) methods face challenges in achieving high resolution and reducing overspray, particularly in depositing patterned organic thin films for opto-electronic devices like OLEDs, where overspray can contaminate adjacent pixels and affect light output.

Innovation Solution

The use of multiple nozzles with different geometries, such as varying throttle diameters, exhaust distances, and bore angles, allows for improved resolution and reduced overspray by creating a sharper edged pattern without the need for shadow masks, enabling precise deposition of organic materials on substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a single nozzle is used for OVJP, then the device complexity is low, but the manufacturing precision and resolution are insufficient due to overspray

Engineering Contradiction:
Improvedeposition resolutionVSAvoidnozzle configuration
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent divides the single nozzle into multiple nozzles (typically three nozzles arranged in a triangular pattern), where each nozzle deposits a specific color material. This segmentation allows precise control over material deposition patterns while reducing overspray contamination between adjacent pixels, directly improving manufacturing precision without excessive complexity increase.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent combines multiple nozzles into a single integrated print head assembly that operates cooperatively. The nozzles are positioned at specific angles and distances from the substrate, and their deposition patterns overlap to create uniform color mixing. This merging approach achieves high-resolution patterning while maintaining manageable device complexity through unified control.

Inventive Principle:
Principle #5Merging (Combining)

2Manufacturing precision

If the nozzle is positioned closer to the substrate, then the deposition resolution improves, but the overspray increases and contaminates adjacent areas

Engineering Contradiction:
Improveedge sharpnessVSAvoidoverspray contamination
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

By segmenting the deposition task across multiple nozzles positioned at different locations and angles, the patent achieves sharp edges through controlled overlap of deposition patterns. Each nozzle targets a specific region, and the segmented approach prevents any single nozzle from generating excessive overspray that would contaminate adjacent areas.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by positioning each nozzle at optimal distances and angles specific to its function. The nozzles are configured with different exhaust distances from the substrate and different bore angles, allowing each to contribute to sharp edges in its local deposition zone while minimizing overspray in adjacent zones through localized optimization.

Inventive Principle:
Principle #3Local quality

3Stability of the object's composition

If multiple nozzles with different geometries are used, then the film thickness uniformity improves, but the device complexity increases

Engineering Contradiction:
Improvefilm thickness uniformityVSAvoidnozzle geometry variations
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent implements local quality by assigning different geometries to different nozzles based on their specific deposition requirements. Each nozzle's geometry (bore diameter, angle, exhaust distance) is optimized for its local function, allowing the system to achieve uniform overall film thickness through coordinated local variations rather than requiring all nozzles to be identical.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent utilizes parameter changes by varying key nozzle parameters (bore diameter, bore angle, exhaust distance from substrate) across the different nozzles. These parameter variations allow each nozzle to compensate for its position and contribute appropriately to the overall uniform film thickness, achieving composition stability through controlled parameter diversity rather than uniformity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the precision of patterned film deposition, reducing contamination between pixels and improving the quality of opto-electronic devices by achieving sharper edges and more controlled film thickness profiles, thereby increasing the aperture ratio and manufacturing efficiency.

Implementation Method 1

Organic vapor jet printing (OVJP) deposits a patterned organic thin film without the need for a shadow mask by transporting organic vapor in a carrier gas and ejecting it through a nozzle onto a substrate

Methodology Applied
Scientific EffectVapor deposition: Deposition (physical)

Data Source

PatentUS8962383B2Multi-nozzle organic vapor jet printing
Publication Date: 2015.02.24 UNIVERSAL DISPLAY CORP
  • US8962383B2 patent drawing
  • US8962383B2 patent drawing
  • US8962383B2 patent drawing

AI summary

Systems and methods are provided for depositing thin patterned films of materials in which individual elements of the patterned film are deposited by two or more nozzles having different geometries. The different nozzle geometries may include one or more of different throttle diameters, different exhaust diameters, different cross-sectional shapes, different bore angles, different wall angles, different exhaust distances from the substrate, and different leading edges relative to the direction of movement of the nozzles or the substrate. Methods may include steps of ejecting a carrier gas and a material from a plurality of nozzles and depositing the material on a substrate in a plurality of laterally spaced elements.