Multi-nozzle Substrate Processing Liquid Ejection Control
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Solution Overview
Problem
Existing substrate processing technologies face challenges in achieving consistent and precise bevel cutting of semiconductor wafers, particularly in controlling the spread and splashing of processing liquids, which affects cutting accuracy and particle generation.
Innovation Solution
The substrate processing apparatus employs a configuration with multiple nozzles that adjust the ejection angles and positions of processing liquids to optimize the first angle θ and second angle φ, allowing for precise control of liquid spread and splashing, thereby enhancing cutting accuracy and reducing particle generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single nozzle is used to eject processing liquid, then the device structure is simple, but the control precision of liquid spread and splashing is insufficient
Solution Approach 1:
The processing liquid ejection system is divided into multiple nozzles (first nozzle and second nozzle), each independently controlling the ejection of processing liquid at different angles and positions. This segmentation allows precise control over liquid spread patterns and splashing behavior, thereby improving cutting accuracy without requiring a single complex adjustable nozzle system.
Solution Approach 2:
Different nozzles are configured with different ejection angles (first angle θ and second angle φ) and positions to create locally optimized liquid application. The first nozzle targets specific regions with specific ejection parameters while the second nozzle covers different areas with different parameters, allowing tailored control of liquid spread and splashing in different local zones of the substrate peripheral edge.
2Adaptability or versatility
If the ejection angle and position are fixed, then the device structure is simple, but the adaptability to different film types and surface conditions is poor
Solution Approach 1:
The system employs multiple nozzles with different fixed ejection parameters (angles θ and φ, positions) to handle different film types and surface conditions. By selecting appropriate nozzles based on the specific processing requirements, the system adapts to various film characteristics without requiring dynamically adjustable parameters, maintaining structural simplicity while achieving versatility.
3Object-generated harmful factors
If processing liquid is ejected without precise angle control, then the ejection system is simple, but particle generation increases
Solution Approach 1:
Different nozzles are positioned and angled to create locally optimized liquid application patterns that minimize splashing and particle generation in specific zones. The first nozzle with its specific angle θ and position controls liquid application in one region while the second nozzle with different angle φ and position handles another region, reducing overall particle generation through localized precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables improved cutting accuracy, reduced particle generation, and consistent process performance across various film types and surface conditions, achieving desired process outcomes such as short slope widths and low particle counts.
Implementation Method 1
an ejection part (6) configured to eject a processing liquid toward a liquid landing point set in a peripheral edge portion of a front surface of the substrate... one nozzle and another nozzle are configured to be different from each other in at least one of the first angle θ or the second angle φ
Data Source
AI summary
A substrate processing apparatus includes a substrate holder, a rotational driver configured to rotate the substrate holder, and an ejection part configured to eject a processing liquid toward a liquid landing point of the substrate. The ejection part includes a plurality of nozzles that is different from each other in at least one of a first angle θ or a second angle φ. A circle is defined. An angle formed by a straight line, which interconnects a foot of a perpendicular line from an ejection point of the processing liquid to the substrate and the liquid landing point, and a tangential line to the circle at the liquid landing point is defined as a first angle θ, and an angle formed by that straight line and a straight line, which interconnects the ejection point and the liquid landing point, is defined as a second angle φ.