Multi-Outlet Cooling Structure for Head-Mounted Display Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As electronic devices become increasingly miniaturized and integrated with multiple functions, heat dissipation becomes a significant challenge, particularly in devices like head-mounted displays, where heat sources such as processors and displays generate substantial heat that can impair performance and user experience.
Innovation Solution
A heat dissipation structure is implemented in electronic devices, including a housing with a printed circuit board, display, and a fan structure with multiple outlets to effectively dissipate heat generated from both the heat source and display, utilizing a first outlet adjacent to the printed circuit board and a second outlet in contact with the display plate to facilitate heat transfer and convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic devices are miniaturized and integrated with multiple functions, then device portability and functionality are improved, but heat dissipation becomes more difficult and heat accumulation increases
Solution Approach 1:
The heat dissipation structure is segmented into multiple independent outlets (first outlet adjacent to printed circuit board, second outlet in contact with display plate, third outlet if applicable) that separately target different heat sources. This segmentation allows each outlet to efficiently dissipate heat from specific components without interfering with other device functions, resolving the contradiction between miniaturization and heat dissipation.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by positioning outlets at different locations and orientations within the housing. The first outlet is disposed adjacent to the printed circuit board, the second outlet contacts the display plate, creating multi-directional heat dissipation pathways that maximize thermal management in a compact form factor.
2Adaptability or versatility
If multiple heat sources are integrated into a compact device, then device functionality is improved, but heat accumulation and performance impairment increase
Solution Approach 1:
Different heat dissipation pathways are created for different heat sources: the first outlet targets the printed circuit board heat source, while the second outlet targets the display plate heat source. This segmented approach prevents heat accumulation at specific components, maintaining performance stability despite multiple integrated functions.
Solution Approach 2:
The fan structure acts as an intermediary that actively moves air through the designated outlets to facilitate heat transfer from heat sources to the external environment. This intermediary mechanism ensures reliable heat dissipation that maintains device performance under various operating conditions.
3Temperature
If heat dissipation structure is added to manage thermal energy, then temperature control is improved, but device complexity increases
Solution Approach 1:
The heat dissipation structure is merged with the housing and existing device components. The outlets are integrated into the housing structure, and the fan is positioned to work with the existing layout of heat sources. This merging approach provides effective temperature control while minimizing the addition of separate, complex subsystems.
Solution Approach 2:
The fan structure serves multiple functions: it drives air flow through all outlets simultaneously, cools multiple different heat sources (printed circuit board, display plate), and can be controlled based on thermal conditions. This multi-functionality reduces overall device complexity by using a single component to address multiple thermal management needs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat dissipation, ensuring optimal device performance and user experience by efficiently removing heat from both the heat source and display components, thereby preventing overheating and maintaining functionality.
Implementation Method 1
at least one fan structure comprising a fan and multiple outlets and configured to induce convection so that heat generated inside the electronic device can be discharged to the outside of the electronic device
Implementation Method 2
at least one heat sink in contact with one surface of the display and the other surface facing the fan structure
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A head-mounted display device, according to one embodiment of the present disclosure, may comprise: a housing; a printed circuit board positioned inside the housing and including a heat source; at least one display positioned inside the housing; at least one display plate supporting the display; and at least one fan structure inducing convection so as to discharge heat generated inside the head-mounted display device to the outside of the head-mounted display device, and including a plurality of outlets. The plurality of outlets may include: a first outlet disposed adjacent to the printed circuit board and configured to dissipate heat generated by the heat source; and a second outlet in contact with a portion of the display plate, and configured to dissipate heat that has been generated by the display and transferred to the display plate. Various other embodiments are possible.