Multi-Output LUT Memory Cell for Lower-Cost Coarse-Grained FPGA
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Solution Overview
Problem
The transition from Field Programmable Gate Arrays (FPGA) to Application Specific ICs (ASIC) or Customer-Owned Tooling (COT) chips is hindered by larger chip size, higher fabrication costs, increased power consumption, lower performance, and exorbitant Non-Recurring Engineering (NRE) costs, especially at advanced technology nodes, which discourages innovation and scalability.
Innovation Solution
A multichip package comprising standardized commodity FPGA IC chips, non-volatile memory IC chips, and supporting IC chips, allowing for field-programmable logic drives that reduce NRE costs by using advanced technology nodes and enabling innovators to implement algorithms and applications through software configuration, similar to a public innovation platform.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If FPGA IC chip is used for a given application, then flexibility and reconfigurability are improved, but chip size increases, fabrication cost increases, power consumption increases, and performance decreases compared to ASIC or COT chip
Solution Approach 1:
The patent divides the FPGA chip into multiple coarse-grained reconfigurable regions (CGRs) that can be independently configured. Each CGR contains multiple fine-grained logic elements that can be dynamically allocated, allowing the chip to be segmented into functional blocks that match the specific application requirements, thereby reducing the area occupied by unused logic elements while maintaining flexibility.
Solution Approach 2:
The patent implements dynamic reconfiguration capability where the FPGA chip can change its logic structure during runtime. The configuration memory stores multiple configuration sets that can be loaded to reconfigure the CGRs and interconnect structures, allowing the chip to adapt its area utilization dynamically based on different operational modes or applications.
2Adaptability or versatility
If FPGA IC chip is used for a given application, then flexibility and reconfigurability are improved, but fabrication cost increases compared to ASIC or COT chip
Solution Approach 1:
The patent designs a universal CGR architecture that can implement multiple logic functions through a single standardized structure. The CGR contains configurable logic elements, interconnect resources, and memory blocks that can be programmed to perform different functions, eliminating the need for multiple specialized ASIC designs and reducing fabrication costs through volume production of a single FPGA chip design.
Solution Approach 2:
The patent uses configurable parameters in the CGR structure (such as logic element types, interconnect widths, and memory sizes) that can be adjusted through programming to match different application requirements. This allows a single FPGA chip design to serve multiple applications with different specifications, reducing the need for costly re-spins and lowering overall fabrication costs.
3Adaptability or versatility
If FPGA IC chip is used for a given application, then flexibility and reconfigurability are improved, but power consumption increases compared to ASIC or COT chip
Solution Approach 1:
The patent segments the FPGA chip into multiple CGRs that can be independently powered or clocked. When a specific application is loaded, only the relevant CGRs are activated while others are placed in low-power states, reducing overall power consumption compared to keeping the entire chip fully operational and configurable.
Solution Approach 2:
The patent implements periodic reconfiguration capability where the FPGA chip can switch between different configuration sets at predetermined intervals or triggers. This allows the system to optimize power consumption by loading configurations that minimize active logic elements for different operational phases, reducing average power consumption while maintaining flexibility.
4Adaptability or versatility
If FPGA IC chip is used for a given application, then flexibility and reconfigurability are improved, but performance decreases compared to ASIC or COT chip
Solution Approach 1:
The patent implements dynamic reconfiguration that allows the FPGA chip to switch between different logic configurations during runtime to optimize performance for different operational modes. The CGR architecture enables hot-swapping of configuration sets without resetting the entire chip, allowing performance-critical sections to be reconfigured on-the-fly while maintaining high-speed operation.
Solution Approach 2:
The patent pre-configures multiple optimization profiles in the configuration memory that can be rapidly loaded based on the current application requirements. These pre-prepared configurations include optimized logic paths, interconnect settings, and resource allocations that maximize performance for specific task types, eliminating the need for runtime synthesis and compilation that would degrade performance.
5Productivity
If advanced technology nodes are used for ASIC or COT chip, then performance and integration density are improved, but NRE cost increases greatly exceeding $5M or even $10M, $20M, $50M or $100M
Solution Approach 1:
The patent uses a standardized CGR architecture that can be copied and replicated across multiple FPGA chip designs at advanced technology nodes. Once the CGR IP core is developed and validated, it can be instantiated in multiple configurations for different applications without requiring new NRE investment, effectively copying the proven architecture to achieve high performance at lower costs.
Solution Approach 2:
The patent creates a universal CGR platform that can be configured for multiple applications through programming rather than hardware redesign. The same advanced-node FPGA chip with CGR architecture can serve different markets and applications by loading different configuration sets, eliminating the need for expensive NRE investment in multiple ASIC designs while maintaining high performance and integration density.
Data Source
AI summary
A semiconductor integrated-circuit (IC) chip comprises a memory cell including: a latch circuit comprising first and second inverters coupling to each other, a first latch node coupling to an input point of the first inverter and an output point of the second inverter and a second latch node coupling to an input point of the second inverter and an output point of the first inverter; a first N-type MOS transistor having a first terminal coupling to the first latch node, a second terminal coupling to a first output point of the memory cell, and a first gate terminal for controlling coupling between the first latch node and the first output point of the memory cell; a second N-type MOS transistor having a third terminal coupling to the second latch node, a fourth terminal coupling to a second output point of the memory cell, and a second gate terminal for controlling coupling between the second latch node and the second output point of the memory cell; and a P-type MOS transistor having a fifth terminal coupling to the first latch node, a sixth terminal coupling to a third output point of the memory cell, and a third gate terminal for controlling coupling between the first latch node and the third output point of the memory cell.


