Multi-Package Stacking with Organic Substrates for RF Integration
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Solution Overview
Problem
Current technologies face challenges in integrating multiple functional components, such as radios supporting various modes and bands, into small form factors while maintaining cost-effectiveness and high performance.
Innovation Solution
A multi-package system is developed, utilizing organic dielectric layers and conductive layers to form passive devices, with electrical connectors for inter-package connection, enabling compact and high-performing integration of radio frequency components like global universal radio units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple functional components are integrated into a small form factor, then the device size is reduced, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent divides the integrated system into multiple separate packages, each containing specific functional components (RF components, passive devices, antennas). These segmented packages are then stacked vertically and interconnected via electrical connectors, allowing complex functionality to be achieved while maintaining manageable manufacturing processes for each individual package
Solution Approach 2:
The patent transitions from planar integration to three-dimensional stacking architecture. Multiple packages are arranged vertically along the Z-axis rather than being laid out horizontally, enabling compact integration of multiple radio frequencies and functions while reducing the footprint area and managing complexity through vertical modularization
2Adaptability or versatility
If multiple radio frequencies and functions are integrated, then the functionality is enhanced, but the device size increases
Solution Approach 1:
The patent implements a nested packaging structure where multiple functional packages (containing different RF components, filters, amplifiers, and antennas for various frequency bands) are stacked one on top of another. This nesting approach allows multiple radio frequency functions to be integrated into a compact vertical arrangement, supporting Quad band GSM, WCDMA, GPS, and MIMO WLAN without proportionally increasing device volume
Solution Approach 2:
The stacked package architecture is designed to support multiple radio frequency standards and functions within a single integrated system. Each package can be configured for specific functions (e.g., GPS antenna in one package, WLAN components in another), and the universal stacking platform accommodates various combinations to achieve multi-functionality including cellular, wireless fidelity, and positioning capabilities
Data Source
AI summary
Example embodiments of the invention may provide for a multi-package system. The multi-package system may include a first package having a plurality of first organic dielectric layers, where the first package includes at least one first conductive layer positioned between two of the plurality of first organic dielectric layers, and where the at least one first conductive layer is circuitized to form at least one first passive device. The multi-package system may also include a second package having a plurality of second organic dielectric layers, where the second package includes at least one second conductive layer positioned between two of the plurality of second organic dielectric layers, and where the at least one second conductive layer is circuitized to form at least one second passive device. An electrical connector may be provided between a bottom surface of the first package and a top surface of the second package to electrically connect the first package and the second package.