Multi-Package Top Heatsink for Power Semiconductor Cooling
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Solution Overview
Problem
Existing power semiconductor arrangements face challenges in efficiently cooling multiple packages simultaneously, which can lead to increased heat dissipation issues and reduced performance in high-power applications.
Innovation Solution
A power semiconductor arrangement featuring a carrier with multiple packages, each equipped with a lead frame structure and a top heatsink that is electrically contacted to the packages' top layers, allowing for simultaneous cooling and conducting of die load currents across the packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple packages are cooled using separate cooling mechanisms, then each package can be cooled effectively, but the device complexity and manufacturing difficulty increase significantly
Solution Approach 1:
The patent combines multiple separate cooling mechanisms into a single integrated top heatsink structure that simultaneously cools multiple packages. The heatsink includes multiple heat dissipation elements arranged to contact top layers of different packages, consolidating what would otherwise require multiple independent cooling systems into one unified component.
Solution Approach 2:
The top heatsink serves multiple functions simultaneously: it provides thermal management for multiple packages, acts as a common mounting structure, and facilitates heat dissipation across the entire power semiconductor arrangement. This multi-functional design eliminates the need for separate cooling components for each package.
2Device complexity
If a common top heatsink is used for multiple packages, then device complexity is reduced, but ensuring adequate cooling for each package becomes more difficult
Solution Approach 1:
The top heatsink is segmented into multiple heat dissipation elements, with each element specifically designed to contact and cool the top layer of an individual package. This segmentation ensures that heat is dissipated uniformly across all packages while maintaining a unified cooling structure.
Solution Approach 2:
Different regions of the top heatsink are designed with locally optimized heat dissipation characteristics. Each heat dissipation element is positioned and dimensioned to match the thermal requirements of its corresponding package, providing tailored cooling where needed while maintaining overall structural simplicity.
3Area of stationary object
If packages are arranged closely to reduce area, then space efficiency improves, but heat dissipation and current conduction become more challenging
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by extending heat dissipation elements vertically from the top layers of packages. This dimensional change allows efficient heat dissipation while maintaining close horizontal spacing between packages, optimizing both area utilization and thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat and manages load currents across multiple packages, enhancing the performance and reliability of power semiconductor devices in high-power applications by ensuring efficient heat management and current conduction.
Implementation Method 1
The top heatsink is electrically contacted to each of the top layers of the packages and configured to conduct at least the sum of the die load currents
Implementation Method 2
The primary function of the heat dissipation device is to remove heat away from the package body
Implementation Method 3
The top heatsink is electrically contacted to each of the top layers of the packages and configured to conduct at least the sum of the die load currents
Data Source
AI summary
A power semiconductor arrangement includes a carrier and packages. Each package: encloses a power semiconductor die having first and second load terminals and configured to conduct a die load current between the load terminals; has a package body with a top side, a footprint side and sidewalls extending from the footprint side to the top side; a lead frame structure configured to electrically and mechanically couple the package to the carrier with the package footprint side facing the carrier, the lead frame structure including at least one first outside terminal electrically connected with the first load terminal of the die; a top layer arranged at the package top side and electrically connected with the second load terminal of the die. A top heatsink is attached to each package top layer, electrically contacted to each package top layer, and configured to conduct at least a sum of the die load currents.