Multi-Pad Lead Structure for Dense Semiconductor Packaging
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Solution Overview
Problem
Conventional semiconductor devices face limitations in higher integration due to the use of multiple metal leads for conduction paths, which hinder the denser packing of electronic components.
Innovation Solution
The semiconductor device incorporates a conductive part on the substrate surface, with first and second pads connected by a lead via a conductive bonding material, allowing for thinner and denser conduction paths and reducing noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple metal leads are used to increase the number of conduction paths, then the number of signals that can be transmitted increases, but the integration density decreases and the device size increases
Solution Approach 1:
The patent transitions from using multiple separate metal leads extending in one dimension to a single lead with multiple bonding pads in another dimension. The lead is bonded to multiple pads (first pad, second pad, third pad) at different locations, effectively utilizing spatial distribution rather than increasing linear lead count, thus achieving higher signal capacity without proportional increase in device footprint
Solution Approach 2:
A single lead structure serves multiple functions by being bonded to multiple separate pads (first pad, second pad, third pad). This multi-functional lead can transmit multiple signals simultaneously through different bonding points, replacing what would traditionally require multiple separate leads, thereby increasing adaptability while maintaining compact device size
2Adaptability or versatility
If multiple metal leads are used to increase the number of conduction paths, then the number of signals that can be transmitted increases, but the integration density decreases
Solution Approach 1:
The patent merges multiple conduction functions into a single lead structure. Instead of using separate leads for each signal path, one lead is bonded to multiple pads (first pad, second pad, third pad), combining multiple conduction paths into a single component. This merging approach increases the number of transmittable signals while reducing the number of discrete leads required, thereby improving integration density
Solution Approach 2:
The lead structure is segmented into multiple bonding regions (first bonding pad, second bonding pad, third bonding pad) that can independently connect to different circuits. This segmentation allows the single lead to handle multiple signals simultaneously through its different segments, increasing functional capacity without increasing overall component count or device complexity
3Device complexity
If a lead is connected to a single pad, then the connection is simple, but noise from one component can affect another component through the same lead
Solution Approach 1:
The lead is segmented into multiple independent bonding pads (first bonding pad, second bonding pad, third bonding pad) rather than having a single connection point. This segmentation creates electrically separated connection regions on the same lead, allowing noise generated at one pad to be isolated from other pads through the lead's inherent impedance and physical separation, thereby reducing noise interference while maintaining connection simplicity
Solution Approach 2:
The multiple pads on the lead act as intermediaries between different circuit components. By bonding to separate pads rather than having direct point-to-point connections, the lead structure provides intermediate connection points that can isolate noise through their distributed configuration and the impedance characteristics of the bonding joints, reducing harmful noise transmission between components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables higher integration and reduces noise input to electronic components, improving the semiconductor device's performance and efficiency.
Implementation Method 1
a first lead bonded to the conductive part via the conductive bonding material and partially exposed from the sealing resin
Data Source
AI summary
A semiconductor device includes a substrate, a conductive part formed on a front surface of the substrate, a semiconductor chip disposed on the front surface of the substrate, a control unit that controls the semiconductor chip, a sealing resin that covers the semiconductor chip, the control unit and the conductive part, and a first lead bonded to the conductive part and partially exposed from the sealing resin. The conductive part includes a first pad and a second pad disposed apart from each other. The first lead is bonded to the first pad and the second pad.