Multi-Exposed Die Pad Packaging for Heat and Solder Control
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Solution Overview
Problem
Semiconductor packages suffer from inadequate heat dissipation and solder flow issues, leading to potential damage and cosmetic defects.
Innovation Solution
The packages incorporate lead frames with multiple die pads separated by gaps and exposed to the exterior, and in some cases with recessed and non-recessed areas, to facilitate heat dissipation and prevent solder flow into critical gaps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple die pads are used to improve heat dissipation, then thermal management is improved, but solder flow into gaps between pads causes cosmetic defects
Solution Approach 1:
The die pads are segmented into multiple separate pads with gaps between them, allowing heat dissipation through multiple exposed surfaces while the gaps are filled with non-conductive material to prevent solder flow into critical areas
Solution Approach 2:
A non-conductive material is introduced as an intermediary substance to fill the gaps between die pads, preventing solder from flowing into the gaps while allowing heat to dissipate through the exposed pad surfaces
2Temperature
If die pads are exposed to exterior for heat dissipation, then thermal management is improved, but solder can flow into gaps causing short circuits
Solution Approach 1:
The die pads are divided into multiple separate exposed pads, increasing the surface area for heat dissipation while maintaining electrical isolation through the non-conductive gap-filling material
Solution Approach 2:
Non-conductive material serves as an intermediary barrier between the exposed die pads, preventing solder from creating electrical shorts while allowing thermal energy to dissipate through the exposed pad surfaces
3Reliability
If recessed areas are created in pads to prevent solder flow, then solder protection is improved, but manufacturing complexity increases
Solution Approach 1:
The pad structure is segmented into recessed and non-recessed areas, creating a simplified geometry that prevents solder flow while maintaining ease of manufacturing through standard molding processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation and prevents solder flow, maintaining package integrity and functionality while allowing for current measurement and improved thermal management.
Implementation Method 1
applying a mold compound to the lead frame and the device
Data Source
AI summary
In an example, an apparatus comprises a lead frame that includes a first row of leads, a first pad coupled to the first row of leads, and a second row of leads parallel to the first row of leads. The lead frame also includes a second pad coupled to the second row of leads. The first and second pads are separated by a gap, and each of the first and second pads has a substantially uniform thickness. The apparatus also includes a device coupled to the first and second pads. The first and second pads are exposed to an exterior of the apparatus.