Multi-Pad Substrate Layout for Mixed Component Transfer
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Solution Overview
Problem
Existing technologies face challenges in integrating multiple pads suitable for different mass transfer techniques on the same substrate, as various components require specific bonding configurations.
Innovation Solution
An electronic device with a substrate featuring multiple conducting layers and pads of varying metal configurations, allowing for integration of electronic components via different mass transfer methods, including fluid and pick-and-place techniques, and enabling repair or replacement of defective components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple substrates are used to accommodate different mass transfer techniques, then each component can have its suitable bonding configuration, but the device complexity and manufacturing steps increase
Solution Approach 1:
The patent merges multiple bonding pads with different metal configurations onto a single substrate. The substrate includes a first bonding pad with a first metal configuration suitable for first mass transfer technique, and a second bonding pad with a second metal configuration suitable for second mass transfer technique. This consolidation eliminates the need for multiple separate substrates while maintaining compatibility with different mass transfer techniques.
Solution Approach 2:
The substrate is designed with multi-functionality to support various mass transfer techniques. By incorporating multiple bonding pads with different metal configurations (such as different metal layers, thicknesses, or material compositions) on the same substrate, the substrate can universally accommodate different types of electronic components that require different bonding methods, making it a universal platform for component integration.
2Adaptability or versatility
If multiple substrates are used for different components, then each component can be optimized for its specific mass transfer technique, but the manufacturing costs increase
Solution Approach 1:
The patent combines multiple bonding pads with different metal configurations onto a single substrate, eliminating the need to manufacture and assemble multiple separate substrates. This consolidation reduces manufacturing complexity, material costs, and assembly operations while maintaining the optimized metal configurations needed for different mass transfer techniques.
Solution Approach 2:
The substrate serves as a universal platform that maintains optimized bonding configurations for different mass transfer techniques. By making the substrate multi-functional with multiple pad types, it eliminates the need for multiple specialized substrates, thereby reducing overall manufacturing costs while preserving technique-specific optimizations.
3Adaptability or versatility
If multiple substrates are used to integrate different components, then each component can have its suitable bonding configuration, but the number of manufacturing steps increases
Solution Approach 1:
The patent merges multiple bonding pads with different metal configurations onto a single substrate, allowing different electronic components to be integrated in a single manufacturing process rather than requiring multiple substrates to be assembled through additional steps. This consolidation reduces the number of manufacturing and assembly operations required.
Data Source
AI summary
An electronic device with an active region comprising a substrate; a first conducting layer, disposed on the substrate, comprising a first pad in the active region; a second conducting layer, disposed on the first conducting layer, comprising a second pad in the active region; a first electronic component, disposed on the first pad, and electronically connected to the first pad; and a second electronic component, disposed on the second pad, and electronically connected to the second pad.