Multi-Path Component Cooler for High-Density Chip Heat Dissipation
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Solution Overview
Problem
Existing cooling solutions for computing devices, such as heat sinks and fluid cooling systems, face challenges in efficiently dissipating heat due to limited thermal contact and single flow path limitations, which hinder effective heat removal from high-power, high-density integrated circuits.
Innovation Solution
A component cooling apparatus utilizing multiple heat pipes and fluid flow paths with a manifold to split and merge fluid flows across multiple heat transfer elements, allowing for controlled flow rates and enhanced heat dissipation, along with thermoelectric coolers for sub-ambient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single fluid flow path is used in the cooling system, then the device complexity is reduced, but the heat dissipation efficiency is limited
Solution Approach 1:
The cooling system is divided into multiple independent fluid flow paths (first fluid flow path, second fluid flow path, etc.), each capable of carrying cooling fluid separately. This segmentation allows parallel heat removal from different heat transfer elements, increasing overall heat dissipation efficiency while maintaining manageable system complexity through modular path design.
2Productivity
If multiple heat transfer elements are used to increase heat dissipation, then the heat removal capability is improved, but the thermal contact area with the heat-generating component is limited
Solution Approach 1:
The patent transitions from a single-plane heat transfer approach to a multi-dimensional heat removal system. Multiple heat transfer elements are arranged in different spatial configurations (e.g., stacked or distributed across multiple surfaces), allowing heat to be removed from various zones of the heat-generating component simultaneously. This dimensional expansion effectively increases the total thermal contact area without concentrating all heat transfer in one location.
3Ease of manufacture
If the cooling system is simplified with fewer components, then the ease of manufacture is improved, but the ability to manage high-power, high-density heat generation is reduced
Solution Approach 1:
The cooling system is divided into multiple independent but identical modules, each consisting of a heat transfer element connected to a fluid flow path. This modular segmentation allows for standardized manufacturing of individual units that can be assembled in series to achieve the required heat dissipation capacity. Each module can be manufactured and tested independently, simplifying the overall manufacturing process while scaling the heat dissipation capacity by adding more modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly increases heat dissipation efficiency by distributing heat removal across multiple paths and utilizing thermoelectric coolers, effectively managing heat generation in high-power computing components.
Implementation Method 1
The component cooler includes multiple heat pipes distributed across a lower surface of the integrated circuit package, each heat pipe having a first end in contact with a respective one of a plurality of heat transfer elements and a second end in contact with the integrated circuit package
Implementation Method 2
multiple conduction paths between multiple heat transfer elements to facilitate heat removal from the component
Implementation Method 3
multiple fluid flow paths across multiple surfaces to facilitate heat removal from the component
Implementation Method 4
The component cooler can also incorporate one or more thermoelectric coolers (TECs) in contact with one or more of the heat transfer elements to provide sub-ambient cooling to the heat transfer elements
Data Source
AI summary
An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component and a second heat transfer element configured to be thermally coupled to the heat-generating component. A manifold is configured to receive a single fluid flow of a heat transfer medium and split the single fluid flow into a first split fluid flow provided to the first heat transfer element and a second split fluid flow provided to the second heat transfer element.