Multi-Path Heat Pipe Cooler for High-Power IC Thermal Management
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Solution Overview
Problem
The increasing demand for greater processing power in computing devices leads to higher heat generation in integrated circuits (ICs), making it challenging to efficiently remove heat using existing cooling solutions.
Innovation Solution
A component cooling apparatus that utilizes multiple heat pipes to split the heat load across multiple conduction paths between heat transfer elements, along with a fluid manifold providing multiple fluid flow paths and thermoelectric coolers for sub-ambient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If existing cooling solutions (single heat pipe, simple heat sink) are used, then device complexity is low, but heat removal effectiveness is insufficient for high-power ICs
Solution Approach 1:
The cooling apparatus is divided into multiple functional segments: multiple heat pipes (first heat pipe, second heat pipe) with different configurations, a manifold with separate fluid passages, and multiple heat transfer elements. Each segment handles specific heat loads from different ICs, allowing distributed heat removal that improves effectiveness while maintaining manageable complexity through modular design.
Solution Approach 2:
The patent introduces vertical stacking of heat transfer elements above the ICs, utilizing the third dimension (height) to increase heat dissipation surface area without expanding the horizontal footprint. This dimensional approach allows multiple heat transfer elements to be positioned at different heights, creating multiple thermal pathways and improving heat removal effectiveness in a compact form factor.
2Productivity
If multiple heat pipes and fluid flow paths are implemented, then heat transfer efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The manifold serves multiple functions simultaneously: it distributes cooling fluid to multiple heat transfer elements through separate passages, collects heated fluid from all elements, and provides structural support for mounting the heat transfer elements. This multi-functionality consolidates what would otherwise require multiple separate components, improving heat transfer efficiency while simplifying manufacturing.
Solution Approach 2:
Multiple heat pipes are merged into a unified cooling system through the manifold, which integrates their fluid outlets into a common distribution network. The heat transfer elements are also merged with the ICs through direct thermal contact, creating an integrated thermal management solution that improves efficiency while reducing the number of discrete assembly steps.
3Temperature
If thermoelectric coolers are added for sub-ambient cooling, then cooling capability is enhanced, but device complexity and power consumption increase
Solution Approach 1:
Thermoelectric coolers are applied locally to specific heat transfer elements that require sub-ambient cooling, rather than cooling the entire system uniformly. This targeted approach enhances cooling capability for high-power ICs that need it most, while minimizing power consumption by avoiding unnecessary cooling of low-power components.
Solution Approach 2:
The system dynamically adjusts cooling parameters by using thermoelectric coolers to actively lower the temperature of specific heat transfer elements below ambient temperature when needed. This parameter change (from passive ambient cooling to active sub-ambient cooling) enhances cooling capability for high-power ICs while allowing the system to operate in lower-power modes when full cooling capacity is not required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides more effective and efficient cooling of components within computing devices by creating multiple heat transfer paths and fluid flow paths, effectively managing heat removal from high-power ICs.
Implementation Method 1
The apparatus includes a first heat transfer element thermally coupled to a heat-generating electronic component; a second heat transfer element; and a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element
Implementation Method 2
The component cooler can also incorporate one or more thermoelectric coolers (TECs) in contact with one or more of the heat transfer elements to provide sub-ambient cooling to the heat transfer elements
Implementation Method 3
a manifold including a first fluid passage providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the heat transfer fluid in thermal contact with the second heat transfer element
Implementation Method 4
fluid-cooled systems
Data Source
AI summary
An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, and a second heat transfer element. The apparatus further includes a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element. Each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. The apparatus further includes a manifold including a first fluid passage providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the heat transfer fluid in thermal contact with the second heat transfer element.