Multi-Path Nozzle for Uniform Jet Plating
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Solution Overview
Problem
Conventional jet plating tanks face issues with complex nozzle structures, increased device size, and uneven plating film thickness due to pressure drop differences between nozzle openings, leading to inefficient plating processes.
Innovation Solution
A nozzle structure for a jet plating tank with a plurality of jet paths formed by partition walls or a perforated plate, arranged to oppose a semiconductor wafer, ensuring uniform ejection of plating liquid and decentralization within the tank.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an annular nozzle with multiple openings is used to eject plating liquid uniformly, then plating film uniformity is improved, but device size increases and installation space is required
Solution Approach 1:
The nozzle is divided into multiple jet paths (first, second, third jet paths) with different ejection directions. Each jet path contains openings at different positions (base end side, middle side, terminal end side) that eject plating liquid in radially outward directions, achieving uniform distribution without requiring a large annular structure
Solution Approach 2:
The invention transitions from a two-dimensional annular nozzle arrangement to a three-dimensional multi-path jet structure. By ejecting plating liquid in different radial directions from multiple jet paths, the system achieves uniform coverage in a compact vertical configuration rather than requiring horizontal expansion
2Manufacturing precision
If multiple openings are arranged in the nozzle to control flow, then plating uniformity is improved, but nozzle structure becomes complicated and cost increases
Solution Approach 1:
The nozzle internal structure is segmented into multiple jet paths separated by partition walls. Each jet path functions as an independent flow channel with openings at specific positions, simplifying the overall design compared to a complex single-chamber multi-opening nozzle while achieving the same uniform distribution effect
Solution Approach 2:
Instead of creating a complex single nozzle with multiple precisely positioned openings, the invention inverts the approach by using multiple simple jet paths with fewer openings each. The partition walls guide the flow in a straightforward manner, reducing manufacturing complexity while maintaining precision
3Manufacturing precision
If a linear nozzle with movable capability is used to adjust flow, then plating uniformity is improved, but device size increases due to movement mechanism
Solution Approach 1:
The invention provides inherent flow distribution dynamics through the multi-path jet structure. The partition walls and opening positions automatically create balanced flow distribution without requiring mechanical movement or adjustment mechanisms, eliminating the need for additional space-consuming actuators
Solution Approach 2:
The nozzle structure self-regulates flow distribution through its geometric design. The different opening positions and jet path configurations automatically balance the plating liquid ejection without external control systems, removing the need for movable components and their associated space requirements
4Ease of operation
If openings are positioned at different distances from the circulation pipe, then flow control is achieved, but pressure drop varies causing uneven ejection amount
Solution Approach 1:
Each jet path is designed with specific local characteristics - openings at different positions (base end, middle, terminal) eject plating liquid in different radial directions. This local differentiation compensates for pressure drop variations, ensuring that despite different distances from the circulation pipe, all jet paths contribute equally to uniform distribution
Solution Approach 2:
The jet paths are intentionally designed asymmetrically with openings at different positions and ejection directions. This asymmetry balances the pressure drop effects - jet paths farther from the circulation pipe have different geometric configurations than those closer, achieving uniform ejection amounts across all paths
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The nozzle structure achieves uniform jetting of plating liquid onto the semiconductor wafer, suppressing drift and ensuring in-plane uniformity of the plating film, while reducing installation space and costs.
Implementation Method 1
a nozzle for jetting plating liquid is arranged so as to oppose the semiconductor wafer... decentralization and homogenization of the plating liquid in the plating tank is conducted by the plating liquid jetted from a terminal end opening portion of each jet path
Implementation Method 2
by applying positive and negative voltage, anode reaction (oxidation reaction) gives rise to the metallic plate in the plating tank and cathode reaction (reduction reaction) gives rise to the semiconductor wafer, respectively. Accordingly, the metallic plate is ionized and metallic ion is eluted in the plating liquid and ionized metal is precipitated on a mounting surface of the semiconductor wafer
Implementation Method 3
anode reaction (oxidation reaction) gives rise to the metallic plate in the plating tank and cathode reaction (reduction reaction) gives rise to the semiconductor wafer
Data Source
AI summary
Provided is a nozzle structure in a jet plating tank through which the nozzle structure can be installed in the reduced space with simple composition, the plating liquid can be almost uniformly jetted on the semiconductor wafer surface and decentralization and homogenization of the plating liquid in the plating tank can be conducted, thereby thickness growth can be promoted. In the nozzle structure, a plurality of jet paths in an opening portion of the nozzle for jetting the liquid formed plating are and decentralization and homogenization of the plating liquid in the plating tank are conducted by the plating liquid jetted from a terminal end opening portion of each jet path.