Multi-PCB Radiation Detector Layout for Gap-Free Scene Scanning

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional radiation detectors face challenges in efficiently scanning a scene without leaving unswept regions due to the arrangement of active areas and radiation beam intersection, which affects the accuracy and completeness of radiation measurement.

Innovation Solution

The imaging system employs a configuration of multiple radiation detectors on group printed circuit boards, where each group's active areas overlap in the normal direction to form a single active area, and are arranged such that a plane parallel to the normal direction intersects all active areas, ensuring comprehensive scanning without unswept regions, with a radiation source and mask optimizing radiation beam distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If multiple radiation detectors are arranged on separate PCBs, then the imaging system can achieve comprehensive scanning coverage, but the system complexity increases due to multiple PCBs and their mounting arrangements

Engineering Contradiction:
Improvescanning coverage areaVSAvoidsystem complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The imaging system is divided into M group PCBs, each carrying Ni radiation detectors. This segmentation allows the large array of radiation detectors to be distributed across multiple manageable PCB modules, enabling comprehensive scanning coverage while maintaining modularity and reducing the complexity of assembling and managing a single large PCB.

Inventive Principle:
Principle #1Segmentation

2Reliability

If radiation detectors are arranged to overlap in the normal direction forming continuous active area, then complete image capture is achieved without unswept regions, but the manufacturing precision requirements increase

Engineering Contradiction:
Improveimage capture completenessVSAvoiddetector arrangement precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The radiation detectors are arranged to overlap in the normal direction (perpendicular to the PCB mounting surface), creating a three-dimensional configuration. This dimensional approach allows the active areas to form a continuous coverage volume, ensuring complete image capture without unswept regions. The overlapping arrangement in the normal direction provides manufacturing tolerance compensation, as slight variations in positioning still maintain the continuous coverage requirement.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Productivity

If the image sensor scans the scene with multiple detector groups, then the scanning speed and productivity improve, but the alignment precision between radiation beam and detector active areas becomes more critical

Engineering Contradiction:
Improvescanning speedVSAvoidbeam-detector alignment precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The active areas of all radiation detectors across M group PCBs are configured to overlap and form one continuous active area in the normal direction. This merging of multiple detector active areas into a unified detection volume ensures that the radiation beam, regardless of slight positioning variations during scanning, will always intersect with at least one active area, thereby maintaining alignment effectiveness while enabling high-speed scanning with multiple detector groups.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for thorough and efficient scanning of a scene, ensuring that all areas are detected without gaps, enhancing the accuracy and completeness of radiation measurement and image formation.

Implementation Method 1

each radiation detector of the Ni radiation detectors on the group PCB (i) comprises (A) a radiation absorption layer and (B) an electronics layer which comprises multiple application specific integrated circuits (ASICs)

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Data Source

PatentUS20230411433A1Imaging systems with image sensors having multiple radiation detectors
Publication Date: 2023.12.21 SHENZHEN XPECTVISION TECH CO LTD
  • US20230411433A1 patent drawing
  • US20230411433A1 patent drawing
  • US20230411433A1 patent drawing

AI summary

Disclosed herein is an imaging system, comprising: an image sensor which comprises: a system printed circuit board (system PCB); M group printed circuit boards (group PCBs (i), i=1, . . . , M) mounted on a mounting surface of the system PCB; and Ni radiation detectors mounted on the group PCB (i), for i=1, . . . , M, wherein M and Ni, i=1, . . . , M are integers greater than 1, wherein the image sensor is configured to scan a scene in a scanning direction, and wherein, for each group PCB (i), there is not a plane which (A) is parallel to a normal direction of the mounting surface of the system PCB, (B) is parallel to the scanning direction, (C) divides all active areas of the Ni radiation detectors into 2 groups of active areas, and (D) does not intersect any active area of all the active areas of the Ni radiation detectors.