Multi-PCB Image Sensor Layout for Gap-Free Scene Scanning
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Solution Overview
Problem
Existing imaging systems with multiple radiation detectors face inefficiencies in scanning coverage and radiation beam alignment, leading to unswept regions and incomplete image capture.
Innovation Solution
The imaging system employs a configuration where each group of radiation detectors on separate PCBs are arranged such that their active areas overlap in the normal direction, forming a single continuous active area, and are scanned in a direction that ensures complete coverage without gaps, with a radiation beam targeting every point of these areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple radiation detectors are arranged on separate PCBs, then the imaging system can achieve comprehensive scanning coverage, but the system complexity increases due to multiple PCBs and their mounting arrangements
Solution Approach 1:
The imaging system is divided into M group PCBs, each carrying Ni radiation detectors. This segmentation allows the large array of radiation detectors to be distributed across multiple manageable PCB modules, enabling comprehensive scanning coverage while maintaining modularity and reducing the complexity of assembling and managing a single large PCB.
2Reliability
If radiation detectors are arranged to overlap in the normal direction forming continuous active area, then complete image capture is achieved without unswept regions, but the manufacturing precision requirements increase
Solution Approach 1:
The radiation detectors are arranged to overlap in the normal direction (perpendicular to the PCB mounting surface), creating a three-dimensional configuration. This dimensional approach allows the active areas to form a continuous coverage volume, ensuring complete image capture without unswept regions. The overlapping arrangement in the normal direction provides manufacturing tolerance compensation, as slight variations in positioning still maintain the continuous coverage requirement.
3Productivity
If the image sensor scans the scene with multiple detector groups, then the scanning speed and productivity improve, but the alignment precision between radiation beam and detector active areas becomes more critical
Solution Approach 1:
The active areas of all radiation detectors across M group PCBs are configured to overlap and form one continuous active area in the normal direction. This merging of multiple detector active areas into a unified detection volume ensures that the radiation beam, regardless of slight positioning variations during scanning, will always intersect with at least one active area, thereby maintaining alignment effectiveness while enabling high-speed scanning with multiple detector groups.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for comprehensive scanning and complete image capture by ensuring all active areas of the radiation detectors contribute to the image without unswept regions, enhancing the imaging system's efficiency and accuracy.
Implementation Method 1
each radiation detector of the Ni radiation detectors on the group PCB (i) comprises (A) a radiation absorption layer and (B) an electronics layer which comprises multiple application specific integrated circuits (ASICs)
Data Source
AI summary
Disclosed herein is an imaging system, comprising: an image sensor which comprises: a system printed circuit board (system PCB); M group printed circuit boards (group PCBs (i), i=1, . . . , M) mounted on a mounting surface of the system PCB; and Ni radiation detectors mounted on the group PCB (i), for i=1, . . . , M, wherein M and Ni, i=1, . . . , M are integers greater than 1, wherein the image sensor is configured to scan a scene in a scanning direction, and wherein, for each group PCB (i), there is not a plane which (A) is parallel to a normal direction of the mounting surface of the system PCB, (B) is parallel to the scanning direction, (C) divides all active areas of the Ni radiation detectors into 2 groups of active areas, and (D) does not intersect any active area of all the active areas of the Ni radiation detectors.