Multi-PCB Antenna Layout for Stronger MST Magnetic Flux
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Solution Overview
Problem
The challenge of integrating antennas in electronic devices with limited space is exacerbated by the need for higher inductance, which increases internal resistance, limiting recognition area and radiation performance, particularly in MST communication.
Innovation Solution
The solution involves a conductive pattern printed on a PCB, specifically a third printed circuit board that connects two antennas, enhancing their recognition area and performance by forming a closed circuit with mutual induction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the inductance of the coil is increased to enhance magnetic flux strength, then radiation performance is improved, but internal resistance increases which weakens magnetic flux strength
Solution Approach 1:
The patent transitions from a single-plane coil structure to a three-dimensional structure by connecting multiple PCBs at different spatial positions. The first antenna is on the first PCB, the second antenna is on the second PCB, and they are connected via the third PCB, creating a立体 (spatial) configuration that increases inductance without proportionally increasing internal resistance.
Solution Approach 2:
The patent combines multiple antenna elements (first antenna and second antenna) into a single integrated antenna system. By electrically connecting the two antennas through the third PCB, they function as a unified high-inductance antenna structure, effectively merging their inductive contributions while sharing the electromagnetic radiation function.
2Reliability
If the coil is made larger to increase inductance, then magnetic flux strength increases, but the available mounting space in the electronic device is limited
Solution Approach 1:
The patent utilizes the third dimension (vertical stacking) by mounting antennas on multiple PCBs at different positions within the device thickness. This allows the antenna system to achieve large effective area and high inductance without increasing the device's footprint area, effectively using vertical space to overcome the mounting space limitation.
Solution Approach 2:
The antenna system is nested within the existing PCB structure and device housing. The first and second PCBs carrying the antennas are integrated into the device's internal space, with the third PCB providing electrical connection between them. This nesting approach allows the antenna system to occupy minimal additional space while achieving high inductance.
3Reliability
If the antenna is mounted in a specific location to optimize performance, then radiation characteristics are improved, but the recognition area is limited due to constrained mounting positions
Solution Approach 1:
By distributing antenna elements across multiple PCBs at different spatial positions and orientations, the patent creates a three-dimensional antenna array. This spatial distribution extends the effective recognition area in multiple directions, overcoming the limitation of single-location mounting while maintaining optimized radiation characteristics through proper geometric arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves antenna performance and space efficiency by expanding the recognition area and enhancing magnetic flux, addressing the limitations of limited mounting space in electronic devices.
Implementation Method 1
a third printed circuit board which is disposed between the display and the second plate and electrically connects the first printed circuit board and the second printed circuit board, and a first antenna coupled to the first printed circuit board, wherein the third printed circuit board includes a second antenna electrically connected to the first antenna
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing including a first plate facing a first direction and a second plate facing a second direction opposite to the first direction, and forming a space between the first plate and the second plate, a display disposed inside the housing and exposed through the first plate, a first printed circuit board disposed between the display and the second plate, a second printed circuit board disposed between the display and the second plate, a third printed circuit board which is disposed between the display and the second plate and electrically connects the first printed circuit board and the second printed circuit board, and a first antenna coupled to the first printed circuit board, wherein the third printed circuit board may include a second antenna electrically connected to the first antenna.