Multi-PCB Power Supply Cooling Structure for Low Thermal Resistance
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Solution Overview
Problem
Conventional power supply systems experience high thermal resistance and low heat dissipation efficiency due to the long path from heat-generating devices to the heat dissipation case without active airflow, leading to inefficient heat transfer.
Innovation Solution
A windless power supply cooling structure is designed with a multi-PCB layout, using thermally conductive potting adhesive layers and insulating spacers, along with heat dissipation cases and copper sheets, to reduce thermal resistance and enhance heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If heat-generating devices are assembled to a heat sink plugged into a PCB, then the device structure is simplified, but the thermal resistance from heat-generating devices to the heat dissipation case becomes very high under windless conditions
Solution Approach 1:
The patent transitions from a single-plane PCB layout to a three-dimensional multi-layer PCB configuration. The first and second PCBs are positioned on opposite sides of the heat dissipation case, with heat-generating devices on the first PCB facing the heat dissipation case and heat-generating devices on the second PCB also facing the heat dissipation case. This spatial arrangement creates multiple direct thermal pathways, dramatically reducing thermal resistance while maintaining structural simplicity.
2Ease of operation
If no fan or active airflow generation is used, then the power supply operates in a windless condition, but the heat transfer resistance by air alone is very high resulting in low heat dissipation efficiency
Solution Approach 1:
The patent divides the heat dissipation function into multiple independent pathways by using separate first and second PCBs positioned on opposite sides of the heat dissipation case. Each PCB with its heat-generating devices creates an independent thermal channel to the heat dissipation case. This segmentation allows heat to be dissipated through multiple parallel paths simultaneously, significantly improving heat dissipation efficiency without requiring active airflow.
3Adaptability or versatility
If the PCB layout has a longer path from power devices to the heat dissipation case, then more components can be accommodated, but the thermal resistance increases
Solution Approach 1:
The patent utilizes the third dimension by positioning PCBs on opposite sides of the heat dissipation case rather than stacking them sequentially in one direction. This creates direct thermal pathways from both sides of the heat dissipation case to heat-generating devices, effectively shortening the thermal path length while providing ample space on each PCB for accommodating multiple components and circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively reduces thermal resistance and improves heat dissipation by shortening the distance between PCBs and heat dissipation cases, utilizing system airflow for efficient heat transfer.
Implementation Method 1
using thermally conductive potting adhesive layers and insulating spacers, along with heat dissipation cases and copper sheets, to reduce thermal resistance and enhance heat dissipation efficiency
Implementation Method 2
Heat exchange for the power supply is carried out through a large exterior area of the heat dissipation case and the surrounding air
Implementation Method 3
using thermally conductive potting adhesive layers and insulating spacers, along with heat dissipation cases and copper sheets, to reduce thermal resistance
Data Source
AI summary
An apparatus includes a case, a first printed circuit board (PCB) and a second PCB within the case. The case includes a top portion and a bottom portion opposite to each other. The first PCB has a first surface and a second surface opposite to each other, and is attached to the top portion of the case via the second surface of the first PCB. At least one heat-generating device is mounted on the first surface of the first PCB. The second PCB has a first surface and a second surface opposite to each other, and is attached to the bottom portion of the case via the second surface of the second PCB. At least one heat-generating device is mounted on the first surface of the second PCB. The apparatus may include more PCBs. An inner shell may be provided forming an air duct within the case.