Multi-PCB RF Transmission Line Layout for Impedance Matching
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Solution Overview
Problem
The challenge is to design compact electronic devices with wireless circuitry that can efficiently transmit radio-frequency signals without the bulkiness of co-axial cables and their connectors, while maintaining satisfactory performance.
Innovation Solution
The integration of radio-frequency transmission lines into printed circuit structures across overlapping printed circuits, where conductive structures on multiple substrates are configured to achieve impedance matching, eliminating the need for discrete impedance matching components and bulky transmission lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If co-axial cables and connectors are used for radio-frequency transmission lines, then satisfactory signal transmission performance is achieved, but the device size increases and space is consumed excessively
Solution Approach 1:
The patent merges the radio-frequency transmission line with the printed circuit board structure by forming conductive traces directly on the PCB substrate. This integration eliminates the need for separate co-axial cables and connectors, achieving both compact device size and satisfactory signal transmission performance through the unified PCB-based transmission line structure
Solution Approach 2:
The patent replaces the mechanical co-axial cable and connector system with an integrated printed circuit board transmission line. The PCB-based transmission line uses conductive traces formed on the substrate to achieve radio-frequency signal transmission, eliminating bulky mechanical connectors while maintaining electrical performance through controlled impedance design
2Volume of moving object
If printed circuit structures are used instead of co-axial cables, then device compactness is improved, but impedance matching becomes more challenging
Solution Approach 1:
The patent controls impedance matching by adjusting physical parameters of the PCB transmission line structure, including trace width, substrate thickness, and dielectric material properties. By varying these parameters during the PCB manufacturing process, the desired characteristic impedance is achieved directly in the integrated transmission line, simplifying the overall design despite the compact form factor
Data Source
AI summary
An electronic device may include one or more radios and one or more antennas. Radio-frequency transmission lines may couple a radio to a corresponding antenna. To more efficiently form a radio-frequency transmission line, the radio-frequency transmission line may be formed from interconnected conductive traces distributed between a plurality of printed circuits. By integrating transmission line structures onto printed circuits that also serve other functions, the device can require less space to implement a radio-frequency transmission line. While one or more of these printed circuits may individually be unsuitable to implement a radio-frequency transmission line with a particular impedance, the composite impedance of these transmission line structures across the printed circuits, when properly configured, may provide a radio-frequency transmission line with the particular impedance.