Multi-Perspective Inspection Apparatus Using Reflection Devices
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Solution Overview
Problem
Conventional visual cosmetic inspection methods for quality control in the 3C industry are time-consuming and inefficient, requiring long inspection cycles to reposition mirrors for multi-perspective views, leading to potential missed defects and a compromise between production rate and quality.
Innovation Solution
An object multi-perspective inspection apparatus using at least two reflection devices arranged to reflect different side views and the bottom view directly to an image capture device, allowing for simultaneous capture of multiple surfaces in one image frame without repositioning, with the reflection devices inclined to be in direct line of sight and refracting devices for supporting and deflecting the object's bottom view.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If mirrors are repositioned for multi-perspective inspection, then multiple surfaces can be inspected, but inspection cycle time increases and productivity decreases
Solution Approach 1:
The patent introduces a temporal dimension to the inspection process by sequentially capturing images at different time points. Instead of using multiple cameras or complex mirror systems to capture all perspectives simultaneously, the system inspects different surfaces of the semiconductor wafer at different time moments within a single inspection cycle, thereby resolving the contradiction between comprehensive inspection and inspection speed.
Solution Approach 2:
The patent employs dynamic movement of the semiconductor wafer during inspection. The wafer is rotated or repositioned between image captures to present different surfaces to the inspection system. This dynamic approach allows a single inspection system to access multiple perspectives through controlled motion, eliminating the need for static multi-camera arrangements and improving productivity.
2Productivity
If multiple cameras are used to capture multiple surfaces simultaneously, then inspection efficiency improves, but device complexity and cost increase
Solution Approach 1:
The patent makes a single image capture device perform multiple functions by inspecting different surfaces of the semiconductor wafer at different time points. This single device is universally applied to capture top surface images, side surface images, and bottom surface images through sequential positioning, thereby eliminating the need for multiple dedicated cameras and reducing system complexity while maintaining inspection efficiency.
Solution Approach 2:
The semiconductor wafer itself serves as the positioning mechanism. By utilizing the wafer's own rotation or repositioning capabilities, the system eliminates the need for external reflection devices or complex camera mounting mechanisms. The wafer presents different surfaces to the inspection system through its own movement, simplifying the overall device architecture.
3Measurement precision
If inspection cycle time is extended to allow mirror repositioning, then multi-surface inspection quality improves, but production rate decreases
Solution Approach 1:
The patent ensures continuous inspection action by seamlessly transitioning between capturing images of different surfaces. The semiconductor wafer is continuously moved or rotated during the inspection process without stopping, and the image capture device continuously records data. This continuous operation eliminates idle time associated with mirror repositioning while maintaining comprehensive inspection quality.
Solution Approach 2:
The system performs preliminary positioning of the semiconductor wafer to predetermined positions before image capture. By pre-positioning the wafer at optimal orientations for capturing top, side, and bottom surface images, the system minimizes the time required during actual image capture and eliminates the need for time-consuming mirror repositioning operations, thereby reducing overall inspection cycle time while maintaining quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces inspection cycle time, increases inspection efficiency, and enhances quality by enabling thorough investigation of multiple surfaces in a single image frame, reducing costs and eliminating the need for additional reflection devices or cameras.
Implementation Method 1
at least two reflection devices (12), being arranged for reflecting simultaneously to the image capture device (10) at least two different side views and the bottom view of the object located in the inspection site (11)
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~4C
AI summary
It is therefore an objective to provide an object multi-perspective inspection apparatus (1) and a method therefor. The apparatus (1) includes an image capture device (10); an inspection site (11) and at least two reflection devices (12), being arranged for reflecting simultaneously to the image capture device (10) at least two different side views of the object located in the inspection site (11); wherein: the image capture device (10) has a field of view including the at least two different side views of the reflection. By introducing reflection devices (12) into the inspection apparatus (1) to enable the image capture device (10) to "see" the part from multiple views at once, multiple surfaces can be inspected at once, in one image frame, without having the need to reposition the reflection device (12), the camera (10) and/or the object for every single surface. There are more than one reflection devices (12) placed in the camera's field of view to assist the inspection process by exploiting otherwise hidden surfaces of any given solid object. The effort inspecting every single part from multiple sides is reduced. Therefore, the period of the inspection cycle time can be reduced and inspection on the level of multi-surfaces becomes possible increasing overall quality.